Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Kohan Lin"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5effa5f274bde44f133b38a29fb3f9ce
https://doi.org/10.23919/icep58572.2023.10129716
https://doi.org/10.23919/icep58572.2023.10129716
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
As modern consumer electronics are continuously driven toward to thinner and compact size, shrinking of assembly package size is a must. One of the challenges for reducing package height is to reduce substrate height, given that substrate provided an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5040d941a8161ee32cba3064361ac335
https://doi.org/10.1109/ectc.2017.109
https://doi.org/10.1109/ectc.2017.109