Zobrazeno 1 - 10
of 63
pro vyhledávání: '"Kohama, Kazuyuki"'
Autor:
Kohama, Kazuyuki
Publikováno v:
In Open Ceramics September 2024 19
Autor:
Kohama, Kazuyuki
Publikováno v:
In Ceramics International 15 March 2024 50(6):8634-8642
Autor:
Kohama, Kazuyuki
Publikováno v:
In Ceramics International 15 August 2021 47(16):22424-22434
Autor:
Sharma, Abhay, Bandari, Vijendra, Ito, Kazuhiro, Kohama, Kazuyuki, M., Ramji, B.V., Himasekhar Sai
Publikováno v:
In Journal of Manufacturing Processes April 2017 26:122-130
Autor:
Kohama, Kazuyuki, Ito, Kazuhiro
Publikováno v:
In Materials & Design 15 November 2016 110:888-894
Autor:
Kohama, Kazuyuki1 (AUTHOR) k.kohama@tc-kyoto.or.jp
Publikováno v:
Science & Technology of Welding & Joining. Jul2020, Vol. 25 Issue 5, p383-390. 8p. 3 Diagrams, 5 Graphs.
Publikováno v:
In Acta Materialia 2012 60(2):588-595
Autor:
Kohama, Kazuyuki, Ito, Kazuhiro
Publikováno v:
Transactions of JWRI. 44(2):23-26
Diffusion bonding of titanium-aluminide based alloys(TiAl)and SS400 low-carbon steels was conducted at 600-800℃for 0-60 min using a spark plasma sintering(SPS)system,then bonding strength of the TiAl/SS400 joints were evaluated by shear tests. Comp
Autor:
Kohama, Kazuyuki, Ito, Kazuhiro
Publikováno v:
Transactions of JWRI. 43(2):37-43
Cu interconnects have been used extensively in ULSI devices. However, large resistance-capacitance delay and poor device reliability have been critical issues as the device feature size has reduced to nanometer scale. In order to achieve low resistan
Autor:
KOHAMA, Kazuyuki, ITO, Kazuhiro, SONOBAYASHI, Yutaka, OHMORI, Kazuyuki, MORI, Kenichi, MAEKAWA, Kazuyoshi, SHIRAI, Yasuharu, MURAKAMI, Masanori
Publikováno v:
電子情報通信学会技術研究報告. SDM, シリコン材料・デバイス. 110(408):31-35
我々は, Cu(Ti)合金薄膜と誘電体層との界面反応を用いた「Ti基自己形成バリア」を検討してきた. 近年, Ti基自己形成バリアが45nmノードのデュアルダマシン配線形成プロセスに適用され, 従