Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Koh Liang Kng Ian"'
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Microchip encapsulation processes involves complex tooling and molding intricacies that affect moldability and quality yield in transfer molding process of packages. Wire sweep during molding is a major concern to mold engineers as the wire deformati
Publikováno v:
2011 International Symposium on Advanced Packaging Materials (APM).
This report discloses an advanced approach to improve the prediction of electronic IC packages' reliability performance by studying packaging materials' thermo-mechanical properties at different high temperature storage conditions. Package level reli
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p272-276, 5p
Publikováno v:
International Symposium on Advanced Packaging Materials (APM), 2011; 2011, p403-409, 7p