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pro vyhledávání: '"Koh Feng Choon"'
Title: Next level of productivity through capillary life extension with automatic capillary cleaning
Autor:
Sivalingam Thevan, Koh Feng Choon
Publikováno v:
36th International Electronics Manufacturing Technology Conference.
In semiconductor industry, wire bonding is often one of the bottleneck processes. This has posed a tremendous challenge in the wire bond interconnect technology to reduce the assembly cycle time and cost of ownership. Nevertheless, long-life capillar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e840f94162183eeade9eb334d8d73037
https://doi.org/10.1109/iemt.2014.7123091
https://doi.org/10.1109/iemt.2014.7123091
Autor:
Koh Feng Choon, Tee Swee Xian
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
The most influence factor of delamination between copper alloy leadframe and epoxy mold compound interface is the finishing leadframe surfaces. Based on leadframe manufacturing process, anti-tarnish is applied by dipping entire leadframe into a solut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e5ee7b3a91de7f75aa28118ccb70a54
https://doi.org/10.1109/eptc.2013.6745837
https://doi.org/10.1109/eptc.2013.6745837