Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Koh, Drake"'
Autor:
K. Y. Au, Y.B. Yang, S Nathapong, Y. S. Koh Drake, P. L Ong Wilson, S. L. Kriangsak, Y. F. Zhang, J.D. Beleran
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Through silicon via (TSV) is a three-dimensional packaging technology involving vertical chips stacking using metal-filled via holes and bumps. TSV stacked chip drastically reduces interconnect distance than conventional multi-stack wire bond silicon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e959db6a93edf0b3156d0cdc5198a0ff
https://doi.org/10.1109/eptc.2011.6184493
https://doi.org/10.1109/eptc.2011.6184493
Autor:
C. Surasit, John D. Beleran, K. Y. Au, C. H. Toh, Y.B. Yang, Y. F. Zhang, Y. S. Koh Drake, P. L Ong Wilson, S. L. Kriangsak
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
High performance, multi functional and package miniaturization will be the main driving forces that propel the future trend and development of fully integrated multi silicon dies stack using through silicon via (TSV) packaging technology. This paper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97d25bd0697c326b473be127bdb34152
https://doi.org/10.1109/ectc.2011.5898529
https://doi.org/10.1109/ectc.2011.5898529
Autor:
Tamil, Jonathan, Siew Hoon Ore, Kian Yeow Gan, Koh, Drake, Ti In, Michael Gantalao, Boon Pek Liew, Teck Wah Park, Ng, Geraldine, Yong Bo Yang, Teh, Daniel, Suthiwongsunthorn, Nathapong, Chungpaiboonpatana, Surasit
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2012 1st Quarter, Vol. 9 Issue 1, p19-30, 12p