Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Koen Thuijs"'
Autor:
Kan Zhou, Xin Guo, Yuyang Bian, Wenzhan Zhou, Yu Zhang, Ijen van Mil, Elly Shi, Robbin Zhu, Jo Zhu, Ivan Mao, Elvira Koolen, Kaiyuan Chi, Jose Carlos Font Trinchant, Gratiela Isai, Selena Chen, Jing Wang, Pei Wang, Shane Su, Xuechen Zhu, Kolos Lin, Kelvin Pao, Koen Thuijs, Peja Lee, Abdalmohsen Elmalk, Sudharshanan Raghunathan, Andy Zhang, Leon Liang, Xander Wang, Gary Zhang
Publikováno v:
2021 International Workshop on Advanced Patterning Solutions (IWAPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72f72295ee02e96ab1c0f80e10d684ae
https://doi.org/10.1109/iwaps54037.2021.9671240
https://doi.org/10.1109/iwaps54037.2021.9671240
Autor:
Jinsun Kim, Seung Yoon Lee, Peter Nikolsky, Wim Tjibbo Tel, Jin-Ho Lee, Koen Thuijs, Hyun-Woo Yu, Yuxiang Yin, Sunyoung Yea, Kim Sang-Uk, Denis Ovchinnikov, Harm Dillen, Jeongjin Lee, Young-Hoon Song, Jae-Seung Jeong, Yun-A Sung, Kaustubh Padhye, James Lee, Antonio Corradi, Joon-Soo Park, Isabel de la Fuente Valentin, Miao Wang, Marc Kea, Daan Slotboom, Vadim Timoshkov, Daniel Park, Jin-Woo Lee, Rhys Su, Chan Hwang, Sun Wook Jung, Oh-Sung Kwon
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
In leading edge patterning processes, overlay is now entangled with CD including OPC residuals and stochastics. This combined effect is a serious challenge for continued shrink and can be characterized with an Edge Placement Error (EPE) budget contai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdbd77fee19202d45a735455ed8ea97a
https://doi.org/10.1117/12.2551997
https://doi.org/10.1117/12.2551997