Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Koen Reynders"'
Publikováno v:
IEEE Transactions on Electron Devices. 52:1008-1013
On-wafer transmission line pulsing (TLP) measurements and transient interferometric mapping experiments on vertically integrated DMOS transistors reveal the presence of hot filament hopping between the two parasitic bipolars. The activity of both int
Publikováno v:
2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..
The paper presents a high voltage power supply ESD protection element containing a high voltage VDMOS which is designed to survive bipolar snapback. For low currents, it operates as an "active clamp", and for high currents, the parasitic vertical bip
Publikováno v:
2004 IEEE International Reliability Physics Symposium. Proceedings.
The effects of hot spot hopping and drain ballasting are investigated in vertical DMOS devices under ESD stress. The frequency of the hot spot hopping between two neighboring channels of the device is shown to be dependent on the dose of the n-type b
Autor:
A. Konrad, Wolfgang Stadler, Heinrich Wolf, M. Frank, N. Qu, Antonio Andreini, H. Gieser, M. Etherton, Kai Esmark, Dionyz Pogany, M. Graf, E. Morena, D. Nuernbergk, J. Willemen, Erich Gornik, M.I. Natarajan, Roberto Stella, Guido Groeseneken, S. Mettler, W. Soppa, Koen Reynders, C. Foss, Wolfgang Wilkening, V. De Heyn, Martin Litzenberger, Mahmud Zubeidat
Publikováno v:
Scopus-Elsevier
CDM hardening during the development of technology, devices, libraries and finally products differs significantly from the process well-established for HBM. This paper introduces a method on the basis of specialized CDM test structures including prot
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