Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Koduck Chen"'
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
A quad flat no-lead (QFN) package delamination improvement and its related lead-frame (LF) copper oxidation effect were studied. Pudding mold adhesion testing method was utilized to determine the epoxy molding compound (EMC)/LF interfacial adhesion p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c7820e0124249aa9727f980b1163de7
https://doi.org/10.1109/estc.2016.7764727
https://doi.org/10.1109/estc.2016.7764727
