Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Kobi Hasharoni"'
Autor:
Konstantinos Papatryfonos, David R. Selviah, Avi Maman, Kobi Hasharoni, Antoine Brimont, Andrea Zanzi, Jochen Kraft, Victor Sidorov, Marc Seifried, Yannick Baumgartner, Folkert Horst, Bert Jan Offrein, Katarzyna Lawniczuk, Ronald G. Broeke, Nikos Terzenidis, George Mourgias-Alexandris, Mingchu Tang, Alwyn J. Seeds, Huiyun Liu, Pablo Sanchis, Miltiadis Moralis-Pegios, Thanasis Manolis, Nikos Pleros, Konstantinos Vyrsokinos, Bogdan Sirbu, Yann Eichhammer, Hermann Oppermann, Tolga Tekin
Publikováno v:
Applied Sciences, Vol 11, Iss 13, p 6098 (2021)
We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics
Externí odkaz:
https://doaj.org/article/1c46f3b4a51c43c5a902a66e3b5fc500
Autor:
Kobi Hasharoni
Publikováno v:
Optical Interconnects XX.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b638e483f596804fba03b7298f645e3
https://doi.org/10.1117/12.2549355
https://doi.org/10.1117/12.2549355
Autor:
Apostolos Siokis, Hui Juan Yan, Pavlos Maniotis, Nikos Pleros, Richard Pitwon, Kobi Hasharoni, Marika Immonen, Kai Wang, N. Terzenidis, Long Xiu Zhu, Konstantinos Christodoulopoulos, Emmanuel Varvarigos
Publikováno v:
Journal of Lightwave Technology. 35:3197-3213
The increased communication bandwidth demands of high performance computing (HPC) systems calling at the same time for reduced latency and increased power efficiency have designated optical interconnects as the key technology in order to achieve the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33be5012a58ac5cd7da3954f491cea4e
https://doi.org/10.1109/jlt.2017.2681972
https://doi.org/10.1109/jlt.2017.2681972
Publikováno v:
International Symposium on Microelectronics. 2013:000873-000877
The electro-optical packaging process of an optical interconnect device is described. The device has an aggregate full duplex bandwidth of 1.3 Tb/s. The optical interconnect is assembled from a standard printed-circuit-board (PCB), an optical module
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4649fc5154bf46ce32b213c2bdf8ccbc
https://doi.org/10.4071/isom-2013-thp41
https://doi.org/10.4071/isom-2013-thp41
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
Switch capacity in the DC is growing fast reaching 25Tb/s in a few years. The main limitations on these large ASICs become chip I/O and its power consumption. Conventional electrical I/O technology is reaching its limit with large switches and replac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6bdbefdec44d802e8301351686ec5e3
https://doi.org/10.1109/icsj.2016.7801294
https://doi.org/10.1109/icsj.2016.7801294
Autor:
Christian Stömmer, Shuki Benjamin, Wolfgang Pleyer, Roland Steffek, Avi Maman, Michael Mesh, Helge Luesebrink, Stanislav Stepanov, Kobi Hasharoni
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
The icPhotonics™ optical module assembly development was presented in [1]. The module allows for aggregate full duplex data rate of better than 1.30 Tb/s with Bit Error Rate (BER)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1047fcc6d03897ec621bd52ad4dff695
https://doi.org/10.1109/ectc.2014.6897413
https://doi.org/10.1109/ectc.2014.6897413
Autor:
Gideon Katz, Itai Epstein, Niv Margalit, David, Michael Mesh, Shuki Benjamin, Stanislav Stepanov, Amir Geron, Kobi Hasharoni
Publikováno v:
Optical Interconnects XIV.
A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fadaa1efa33a2ace436d23740c4c6780
https://doi.org/10.1117/12.2038073
https://doi.org/10.1117/12.2038073
Publikováno v:
Advanced Photonics for Communications.
A high bandwidth parallel optical interconnect is assembled directly on top of an ASIC with mixed digital and analog functionalities. This hybrid assembly allows overcoming the limitations on chip I/O thus building optical networks with the highest p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0881dbfbb59f40549b34ab687caec29
https://doi.org/10.1364/ps.2014.pt4b.1
https://doi.org/10.1364/ps.2014.pt4b.1
Publikováno v:
Journal of the American Chemical Society. 120:6362-6365
We report on an unusual intramolecular electron transfer following the photoexcitation of the ground, charge separated, state of the zwitterionic compound, tetraphenylhexaazaanthracene, which results in a neutral biradical product. The reaction, stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ff51736419c9e685bb716bb6d57f604
https://doi.org/10.1021/ja974018u
https://doi.org/10.1021/ja974018u
Publikováno v:
Journal of Chemical Physics, 108(4), 1390-1394. AMER INST PHYSICS
We report steady-state photo-induced absorption (PIA) and photo-induced reflectance (PIR) in films of poly[2-methoxy-5-(2′-ethyl-hexyloxy)-p-phenylene vinylene] (MEH-PPV) and poly[2,5-bis cholestanoxy-1,4 phenylene vinylene] (BCHA-PPV) blended with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d2f18652a857c48f0cab83ea0ac0f11
https://doi.org/10.1063/1.475550
https://doi.org/10.1063/1.475550