Improved thermal management for GaN power electronics: Silver diamond composite packages

Autor: Faqir, M., Batten, T., Mrotzek, T., Knippscheer, S., Massiot, M., Buchta, M., Blanck, H., Rochette, S., Vendier, O., Kuball, M.

Publikováno v: In Microelectronics Reliability December 2012 52(12):3022-3025

Influence of packaging materials on GaN RF power devices.

Autor: Buchta, M., Thorpe, J., Blanck, H., Beilenhoff, K., Floriot, D., Kuball, M., Mrotzek, T., Knippscheer, S., Courtade, F., Xiong, A.

Publikováno v: 2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials & Processes for RF & THz Applications (IMWS-AMP); 2015, p1-3, 3p

New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography.

Autor: Faqir, M., Manoi, A., Mrotzek, T., Knippscheer, S., Massiot, M., Buchta, M., Blanck, H., Rochette, S., Vendier, O., Kuball, M.

Publikováno v: Journal of Microelectronic & Electronic Packaging; 2011 3rd Quarter, Vol. 8 Issue 3, p110-113, 4p

Silver diamond composite as a new packaging solution: A thermo-mechanical stability study.

Autor: Faqir, M., Batten, T., Mrotzek, T., Knippscheer, S., Massiot, M., Letteron, L., Rochette, S., Vendier, O., Desmarres, J.M., Courtade, F., Kuball, M.

Publikováno v: 2011 27th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM); 2011, p314-316, 3p

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