Zobrazeno 1 - 10
of 58
pro vyhledávání: '"Kleinbichler, A."'
Publikováno v:
In Surface & Coatings Technology 25 December 2023 475
Autor:
Moser, Sebastian, Kleinbichler, Manuel, Zechner, Johannes, Reisinger, Michael, Nelhiebel, Michael, Cordill, Megan J.
Publikováno v:
In Microelectronics Reliability October 2022 137
Autor:
Kleinbichler, Manuel, Kofler, Corinna, Stabentheiner, Manuel, Reisinger, Michael, Moser, Sebastian, Zechner, Johannes, Nelhiebel, Michael, Kozeschnik, Ernst
Publikováno v:
In Microelectronics Reliability December 2021 127
Autor:
Vasileios Fotopoulos, David Mora-Fonz, Manuel Kleinbichler, Rishi Bodlos, Ernst Kozeschnik, Lorenz Romaner, Alexander L. Shluger
Publikováno v:
Nanomaterials, Vol 13, Iss 9, p 1464 (2023)
Voids in face-centered cubic (fcc) metals are commonly assumed to form via the aggregation of vacancies; however, the mechanisms of vacancy clustering and diffusion are not fully understood. In this study, we use computational modeling to provide a d
Externí odkaz:
https://doaj.org/article/01d04daf0f1146a6a5ec0eb97a7e4321
Publikováno v:
In Materials & Design 5 October 2018 155:203-211
Autor:
Cordill, M.J., Kleinbichler, A., Völker, B., Kraker, P., Economy, D.R., Többens, D., Kirchlechner, C., Kennedy, M.S.
Publikováno v:
In Materials Science & Engineering A 26 September 2018 735:456-462
Publikováno v:
In Surface & Coatings Technology 25 December 2017 332:376-381
Akademický článek
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Publikováno v:
In Microelectronic Engineering 5 January 2017 167:63-68
Publikováno v:
Applied Sciences, Vol 11, Iss 15, p 7009 (2021)
In many applications, voids in metals are observed as early degradation features caused by fatigue. In this publication, electropolishing is presented in the context of a novel sample preparation method that is capable of accessing voids in the inter
Externí odkaz:
https://doaj.org/article/6b45f7e5c3f349149e59a1976ca0ccd5