Zobrazeno 1 - 10
of 113
pro vyhledávání: '"Kleer, G."'
Publikováno v:
Philosophical Transactions: Mathematical, Physical and Engineering Sciences, 2011 Jun . 369(1945), 2422-2430.
Externí odkaz:
https://www.jstor.org/stable/23035761
Publikováno v:
In Surface & Coatings Technology 1 October 2005 200(1-4):1088-1092
Publikováno v:
In Surface & Coatings Technology 2005 200(5):1555-1559
Publikováno v:
In Surface & Coatings Technology 30 January 2003 163-164:689-694
Publikováno v:
In Thin Solid Films 2002 402(1):195-202
25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion, 6-10 September 2010, Valencia, Spain; 2062-2065
The reduction of costs by decreasing the breakage rate is one major purpo
The reduction of costs by decreasing the breakage rate is one major purpo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b19e4f1f29fd3b601c439b6691f5ec7
In this contribution, we report on the mechanical properties of iridium coatings with titanium sub-layer deposited by RF magnetron sputtering. Measurements of the coating adhesion were performed with scanning scratch test. The microhardness and effec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::a4cdafeddaa17c507a480b4dbc5eaea1
https://publica.fraunhofer.de/handle/publica/220365
https://publica.fraunhofer.de/handle/publica/220365
24th European Photovoltaic Solar Energy Conference, 21-25 September 2009, Hamburg, Germany; 1419-1423
The reduction of costs by decreasing the breakage rate is one major purpose of research in solar cell production technology. In order to achiev
The reduction of costs by decreasing the breakage rate is one major purpose of research in solar cell production technology. In order to achiev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f9e8752cb51c415c4c4153826c795e2
23rd European Photovoltaic Solar Energy Conference and Exhibition, 1-5 September 2008, Valencia, Spain; 1285-1288
In the wafering process of silicon ingots up to 50% of the silicon is lost due to the sawing process. In order to increase the wafe
In the wafering process of silicon ingots up to 50% of the silicon is lost due to the sawing process. In order to increase the wafe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cca33f6381f40793528bd5124d5700e