Zobrazeno 1 - 10
of 116
pro vyhledávání: '"Klaus-Jurgen Wolter"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:18-29
This article focuses on the morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in small Sn–Ag–Cu (O $270~\mu \text{m}$ ) solder balls. The Cu6Sn5 phase showed a large variety of different shapes and sizes, ranging from facetted hexagonal rod
Autor:
Larysa Baraban, Klaus-Jurgen Wolter, Hyeonsu Cho, Chang-Ki Baek, Gianaurelio Cuniberti, Tetiana Voitsekhivska, Clemens Kirschbaum, Stephanie Klinghammer, Nadia Licciardello, Kihyun Kim
Publikováno v:
ACS Sensors 5(2020)12, 4081-4091
Small molecules with no or little charge are considered to have minimal impact on signals measured by field effect transistor (FET) sensors. This fact typically excludes steroids from the family of analytes, detected by FETs. We present a portable mu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f6556c8b93703a479bceb28f1fe96d12
http://hdl.handle.net/20.500.11769/534582
http://hdl.handle.net/20.500.11769/534582
Autor:
Klaus-Jurgen Wolter, Karlheinz Bock, Tobias Tiedje, Sebastian Lungen, Lukas Lorenz, Krzysztof Nieweglowski
Publikováno v:
Microelectronics Reliability. 84:121-126
This contribution discusses technology development for the realization of chip-to-chip interconnection based on flexible optical waveguides. Two approaches for optical coupling between waveguides and active devices are presented. Both approaches buil
Autor:
Lukas Lorenz, Klaus-Jurgen Wolter, Jörg Franke, Niels Neumann, Zaid Al-Husseini, Dirk Plettemeier, Krzysztof Nieweglowski, Thomas Reitberger, Karlheinz Bock
Publikováno v:
Journal of Lightwave Technology. 35:4033-4039
In this paper, we present a bidirectional interruption-free multimode waveguide coupler for optical bus systems on board and module level. The principle is based on directional core–core coupling and allows for adjustable coupling powers by tuning
Autor:
Klaus-Jurgen Wolter, Krzysztof Nieweglowski, Karlheinz Bock, Florian Loosen, Norbert Lindlein, Lukas Lorenz
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 14:1-10
In this article, we present a coupling concept for an interruption-free asymmetric bidirectional optical bus coupler for board and module level. With this approach, it is possible to connect several electro-optical devices to a single waveguide. A co
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
This paper presents a simulation approach, with which results on multimode bending couplers are obtained much faster than with traditional methods. This is achieved by a two-stage simulation combining ray tracing and beam propagation method. Using th
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
This study focuses on the morphologies of primary Cu 6 Sn 5 intermetallics in small free standing SnCu (O 270 μm) solder balls. Those showed a large variety of different shapes and sizes ranging from facetted hexagonal rods, to partly facetted split
Autor:
Gerd-Albert Hoffmann, Ludger Overmeyer, Klaus-Jurgen Wolter, Lukas Lorenz, Thomas Reitberger, Krzysztof Nieweglowski, Jörg Franke, Karlheinz Bock
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
In this work we present the additive manufacturing of optical multimode waveguides on flexible foil by aerosol jet printing. In order to obtain higher aspect ratios for the waveguides, the foils are conditioned by a flexographic printing step in adva
Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
Autor:
Mel Findlay, James Haley, Klaus-Jurgen Wolter, Peter J. Hesketh, Venky Sundaram, Catherine Shearer, Daniel Struk, Marc Papageorge, Rao Tummala, Chintan Buch
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper describes an ultra-thin, low cost 3D glass sensor packaging platform for near-hermeticity with novel feedthrough and encapsulation technologies. Glass panels of thicknesses ranging from 50 µm to 300 µm are used which limits overall form
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This paper describes advances in integrated ultra-thin wireless power module components for Internet of Things (IoT) and wireless sensor applications. A typical wireless module integrates both an inductive link for wireless power transfer, and superc