Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Klaus-Juergen Wolter"'
Publikováno v:
Journal of Nanotechnology, Vol 2013 (2013)
Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nanotubes has opened new possibilities to fa
Externí odkaz:
https://doaj.org/article/52c53c6c9e1d403c810648a743be1a2c
Autor:
Jörg Franke, Ludger Overmeyer, Norbert Lindlein, Karlheinz Bock, Stefan Kaierle, Oliver Suttmann, Klaus-Jürgen Wolter
Light signals in optical waveguides can be used to transmit very large amounts of data quickly and largely without interference. In the industrial and infrastructural sectors, e.g. in the automotive and aerospace industries, the demand to further exp
Autor:
Gerd-Albert Hoffmann, Karlheinz Bock, Ludger Overmeyer, Lukas Lorenz, Carsten Backhaus, Thomas Reitberger, Oliver Suttmann, Jochen Zeitler, Norbert Lindlein, Alexander Wienke, Joerg Franke, Klaus-Juergen Wolter
Publikováno v:
Applied Industrial Optics 2019.
This paper shows the modeling, simulation and production of polymer optical waveguides using the OPTAVER process. The additive manufactured multimode waveguides with their typical cross-section of a circle shape are of low cost and high-performance.
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
Autor:
Ingrid De Wolf, Iuliana Panchenko, Joke De Messemaeker, Kristof Croes, Eric Beyne, Klaus-Juergen Wolter, M. Juergen Wolf
Publikováno v:
Microelectronics Reliability. 102:113296
The crystal orientation and grain distribution of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) in miniaturized solid-liquid interdiffusion (SLID) interconnects for 3D stacking were investigated. Therefore Cu/Sn microbumps with a diameter of 15 μm
Autor:
J. De Messemaeker, Eric Beyne, Iuliana Panchenko, Kristof Croes, Klaus-Juergen Wolter, I. De Wolf
Publikováno v:
Microelectronic Engineering. 117:26-34
A degradation phenomenon of the Cu6Sn5 IMC in SLID interconnects was found.Degradation is caused by porosity due to a corrosive reaction with flux residues.Sn is dissolved from the solid Cu6Sn5 IMC during the pore formation.The composition of the rem
Autor:
Gerd-Albert Hoffmann, Ludger Overmeyer, Lukas Lorenz, Klaus-Juergen Wolter, Joerg Franke, Thomas Reitberger
Publikováno v:
2016 12th International Congress Molded Interconnect Devices (MID).
As a tribute to the continuously increasing volume of data traffic, optical waveguides have become a serious alternative to electrical circuitries. The potential of precise spaceresolved strain measurements or the capacity to transmit very large amou
Autor:
Klaus-Juergen Wolter, Gianaurelio Cuniberti, F. Zörgiebel, Karlheinz Bock, Tetiana Voitsekhivska, Eike Suthau
Publikováno v:
EMBC
In this study we demonstrate the sensing capabilities of a portable multiplex measurement system for FET-based (bio)chemical sensors with an integrated microfluidic interface. We therefore conducted pH measurements with Silicon Nanoribbon FET-based S
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
The new trends in automotive electronics such as autonomous driving, in-car infotainment, and all-electric cars, require an entirely different electronic vision and technologies than are pursued today for automotive industry. Georgia Tech proposes sy
Autor:
Xuwen Liu, Maik Mueller, Hongtao Chen, Klaus-Juergen Wolter, Jue Li, Tonu Tuomas Mattila, Mervi Paulasto-Kröckel
Publikováno v:
JOURNAL OF MATERIALS RESEARCH. 26(16):2103-2116
The failure mechanism of lead-free solder interconnections of chip scale package–sized Ball Grid Array (BGA) component boards under thermal cycling was studied by employing cross-polarized light microscopy, scanning electronic microscopy, electron
Autor:
Heimann Matthias, Bjoern Boehme, Sebastian, Klaus-Juergen Wolter, Scheffler, Martin Wirts-Ruetters
Publikováno v:
Micro and Nanosystems. 2:15-22