Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Klaus Neumaier"'
Autor:
Klaus Neumaier, Vaclav Valenta, Jonathan Chu, Yunpeng Xiao, Stan Benczkowski, Bob Marquis, Sameer Yadav, Jonathan Harper, Ondrej Picha, Rajani Thirukoluri, Roveendra Paul, Leon Zhang, Levan Bidzishvili, Thierry Bordignon, James Victory
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Autor:
Yafan Zhang, Gerald Weis, Mietek Bakowski, Hans-Peter Nee, Klaus Neumaier, Gerhard Schmid, Olaf Zschieschang
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Silicon carbide embedded power modules enable a compact and cost competitive packaging solution for high-switching frequency and high-temperature operation applications. Power module packaging technologies span several engineering domains. At the ear
Publikováno v:
Heat Transfer Engineering. 35:1505-1519
Electrical power from geothermal heat is hardly efficient, if the temperature level of geothermal water is low. This situation is predominant in middle Europe, for example, in Germany, where even in hot-spot areas like Norddeutsches Becken, Oberrhein
Autor:
Eberhard Kaulfersch, Michael Edwards, Olaf Zschieschang, Klaus Neumaier, Jonas Ottosson, Klas Brinkfeldt, Dag Andersson, Alexander Otto
Publikováno v:
Advanced Microsystems for Automotive Applications 2015 ISBN: 9783319208541
The electrification of drive trains combined with special requirements of the automotive and heavy construction equipment applications drives the development of small, highly integrated and reliable power inverters. To minimize the volume and increas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ba008b3529f4e905f8e7fab7e105d25
https://doi.org/10.1007/978-3-319-20855-8_13
https://doi.org/10.1007/978-3-319-20855-8_13
Autor:
Eberhard Kaulfersch, Michael Edwards, Jonas Ottosson, Klaus Neumaier, Olaf Zschieschang, Dag Andersson, Alexander Otto, Klas Brinkfeldt
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Effectively removing dissipated heat from the switching devices enables a higher current carrying capability per chip area ratio, thus leading to smaller or fewer devices for a given power requirement specification. Further, the use of SiC based devi
Autor:
Michael Edwards, Klas Brinkfeldt, Dag Andersson, Thorbjörn Åklint, Olaf Zschieschang, Klaus Neumaier
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
In power electronics, more efficient removal of heat from the junction of power devices leads to a higher power rating per die, which in turn leads to fewer die and reduced system volume. Since temperature is a main driver in expected failure modes a
Autor:
Alexander Mann, Olaf Zschieschang, Eberhard Kaulfersch, Dag Andersson, Klaus Neumaier, Michael Edwards, Klas Brinkfeldt, Alexander Otto
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Silicon Carbide (SiC) based transistor devices have demonstrated higher efficiency switching operation compared to silicon-based, state-of-the-art solutions due to the superior electrical and thermal properties of the SiC material. The improved curre
Autor:
Eberhard Kaulfersch, Olaf Zschieschang, Dag Andersson, Klas Brinkfeldt, Klaus Neumaier, Sven Rzepka, Alexander Otto
Publikováno v:
Advanced Microsystems for Automotive Applications 2014 ISBN: 9783319080864
Wide-bandgap semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in electric vehicles due to their improved electr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dfb675cc80524f26120790b91fa1191
https://doi.org/10.1007/978-3-319-08087-1_21
https://doi.org/10.1007/978-3-319-08087-1_21