Zobrazeno 1 - 10
of 3 841
pro vyhledávání: '"Klatzky, R L"'
Akademický článek
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Publikováno v:
Psychological Science, 2007 Feb 01. 18(2), 158-164.
Externí odkaz:
https://www.jstor.org/stable/40064597
Autor:
Eysenck, Michael W.
Publikováno v:
British Journal of Psychology. Aug1976, Vol. 67 Issue 3, p450. 2p.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
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Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
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Autor:
Korczyk, Maksymilian1 (AUTHOR) maksym.korczyk@gmail.com, Rączy, Katarzyna2 (AUTHOR), Szwed, Marcin1 (AUTHOR) m.szwed@uj.edu.pl
Publikováno v:
Scientific Reports. 12/28/2024, Vol. 14 Issue 1, p1-11. 11p.
Autor:
Wiles TM; Department of Biomechanics, University of Nebraska at Omaha, 6160 University Dr S, Omaha, NE, 68182, USA., Grunkemeyer A; Department of Biomechanics, University of Nebraska at Omaha, 6160 University Dr S, Omaha, NE, 68182, USA., Stergiou N; Department of Biomechanics, University of Nebraska at Omaha, 6160 University Dr S, Omaha, NE, 68182, USA.; Department of Physical Education and Sport Science, Aristotle University, Thessaloniki, Greece., Likens AD; Department of Biomechanics, University of Nebraska at Omaha, 6160 University Dr S, Omaha, NE, 68182, USA. alikens@unomaha.edu.
Publikováno v:
Psychological research [Psychol Res] 2024 Nov 15; Vol. 89 (1), pp. 16. Date of Electronic Publication: 2024 Nov 15.
Autor:
Flavin MT; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Ha KH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Guo Z; School of Engineering, Westlake University, Hangzhou, China., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Kim JT; Department of Mechanical Engineering, Pohang University of Science and Technology, Pohang, Republic of Korea., Saxena T; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Simatos D; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Al-Najjar F; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Mao Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Institute of Biomedical Manufacturing and Life Quality Engineering, State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China., Bandapalli S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Fan C; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Bai D; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Dalian University of Technology, Dalian, China.; Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; DUT-BSU Joint Institute, Dalian University of Technology, Dalian, China., Zhang Z; School of Engineering, Westlake University, Hangzhou, China., Zhang Y; School of Engineering, Westlake University, Hangzhou, China., Flavin E; Center for Education Integrating Science, Mathematics, and Computing, Georgia Institute of Technology, Atlanta, GA, USA., Madsen KE; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Chemistry, University of Illinois Urbana-Champaign, Urbana, IL, USA., Huang Y; School of Engineering, Westlake University, Hangzhou, China., Emu L; School of Engineering, Westlake University, Hangzhou, China., Zhao J; School of Engineering, Westlake University, Hangzhou, China., Yoo JY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Park M; Department of Polymer Science and Engineering, Dankook University, Yongin, Republic of Korea., Shin J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Molecular Recognition Research Center, Korea Institute of Science and Technology, Seoul, Republic of Korea., Huang AG; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Shin HS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Colgate JE; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Civil & Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science & Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu., Xie Z; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Dalian University of Technology, Dalian, China. zxie@dlut.edu.cn.; Department of Engineering Mechanics, Dalian University of Technology, Dalian, China. zxie@dlut.edu.cn.; DUT-BSU Joint Institute, Dalian University of Technology, Dalian, China. zxie@dlut.edu.cn., Jiang H; School of Engineering, Westlake University, Hangzhou, China. hanqing.jiang@westlake.edu.cn.; Westlake Institute for Advanced Study, Hangzhou, China. hanqing.jiang@westlake.edu.cn.; Research Center for Industries of the Future and School of Engineering, Westlake University, Hangzhou, China. hanqing.jiang@westlake.edu.cn., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science & Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu.
Publikováno v:
Nature [Nature] 2024 Nov; Vol. 635 (8038), pp. 345-352. Date of Electronic Publication: 2024 Nov 06.
Autor:
Wang, Shengkai1 (AUTHOR) shengkai.wang@tum.de, Liu, Bing1 (AUTHOR), Feng, Yu1 (AUTHOR), Meng, Liqiu1 (AUTHOR)
Publikováno v:
Cartography & Geographic Information Science. Oct2024, p1-21. 21p. 8 Illustrations, 4 Charts.
Autor:
Kılıç, Fatma1, Dövencioğlu, Dicle2 dicled@metu.edu.tr
Publikováno v:
Perception. Oct2024, Vol. 53 Issue 10, p674-687. 14p.