Zobrazeno 1 - 10
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pro vyhledávání: '"Kiyoshi Oi"'
Akademický článek
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Autor:
Kei Murayama, Kiyoko Tajima, Mikiko Kobayashi, Junichi Mizushima, Shingo Hayashibe, Kiyoshi Oi
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd04e6930df9f8244fd3a07915b05ad5
https://doi.org/10.1109/apec43580.2023.10131528
https://doi.org/10.1109/apec43580.2023.10131528
Autor:
Sze Pei Lim, Kor Oon Lee, Kiyoshi Oi, Yvonne Yeo, Keith Sweatman, Toshiaki Ono, Kei Murayama, Steven R. Martell, Haruo Shimamoto, Masahiro Tsuriya
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6b9ddfe08fafa4b850d1c65e52ef44b
https://doi.org/10.1109/impact56280.2022.9966698
https://doi.org/10.1109/impact56280.2022.9966698
Autor:
Kor Oon Lee, Kiyoshi Oi, Sze Pei Lim, Yvonne Yeo, Keith Sweatman, Toshiaki Ono, Kei Murayama, Steven R. Martell, Haruo Shimamoto, Masahiro Tsuriya
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68139a306de8320744b72ade0c1ae587
https://doi.org/10.23919/icep55381.2022.9795574
https://doi.org/10.23919/icep55381.2022.9795574
Autor:
Kei Murayama, Kor Oon Lee, Toshiaki Ono, Kiyoshi Oi, Sze Pei Lim, Yvonne Yeo, Keith Sweatman, Steven R. Martell, Haruo Shimamoto, Masahiro Tsuriya
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8fde7ce3eff68de909a9c1c25258d0e
https://doi.org/10.1109/ectc51906.2022.00185
https://doi.org/10.1109/ectc51906.2022.00185
Publikováno v:
2022 IEEE Applied Power Electronics Conference and Exposition (APEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79841e2ad5bf3d70f8fea54d2a043a07
https://doi.org/10.1109/apec43599.2022.9773543
https://doi.org/10.1109/apec43599.2022.9773543
Autor:
Christian Hofmann, Mario Baum, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Soumya-Deep Paul, Kiyoshi Oi, Kei Murayama, Maik Wiemer, Harald Kuhn
Publikováno v:
2021 IEEE CPMT Symposium Japan (ICSJ).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::387f34b21d97f99ea8d4337f2cb4b984
https://doi.org/10.1109/icsj52620.2021.9648867
https://doi.org/10.1109/icsj52620.2021.9648867
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In recent years, global warming prevention and reduction of energy consumption are increasingly required. And technical point of view, low stress bonding is required. A low temperature bonding using Sn-Bi solder is candidate technique to solve these
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b83268729bed44658d8ee8c21c5f5730
https://doi.org/10.1109/ectc32696.2021.00298
https://doi.org/10.1109/ectc32696.2021.00298
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:367-373
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dae4657f8c76d35f5ec9802b72c7c722
https://doi.org/10.5104/jiep.22.367
https://doi.org/10.5104/jiep.22.367
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
The 2.3D i-THOP® (jntegrated-Thin film High density Qrganic r_ackage) with Sn-Bi solder joints has been developed for heterogenous die integration solution. The high reliability joint technology in the interposer assembly process using Sn-Bi solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60aef3d0ca74be350c074ab300991116
https://doi.org/10.23919/icep51988.2021.9451985
https://doi.org/10.23919/icep51988.2021.9451985