Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Kiyohisa Hasegawa"'
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:488-498
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db6dee063811ae4a3fba68b90936e0e9
https://doi.org/10.5104/jiep.25.488
https://doi.org/10.5104/jiep.25.488
Autor:
Kiyohisa Hasegawa, Toshihiko Makino
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:472-480
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c573eb07b929452842b0fddd7f256b65
https://doi.org/10.5104/jiep.25.472
https://doi.org/10.5104/jiep.25.472
Autor:
Kiyohisa Hasegawa
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 21:447-451
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc25899d4e4d3f773bddffd3d35230b0
https://doi.org/10.5104/jiep.21.447
https://doi.org/10.5104/jiep.21.447
Autor:
Tetsuya Fujita, Kiyohisa Hasegawa
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 17:511-515
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c609727e066b2ff5eb8e220f0fa0deeb
https://doi.org/10.5104/jiep.17.511
https://doi.org/10.5104/jiep.17.511
Autor:
Atsushi Sakai, Tomoyuki Tango, Kiyohisa Hasegawa, Takashi Kariya, Shinobu Kato, Ramesh K. Bhandari, Toshio Sudo, Hiroshi Segawa
Si interposer technology has the potential to enable highbandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (≤5um) wiring can be fabricated. However, the ultrafine pitch wirin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::488ddd577059256471a844c8e4570bc8
https://ora.ox.ac.uk/objects/uuid:6aa1aa8a-a385-4b0c-ae0c-65b191c9389c
https://ora.ox.ac.uk/objects/uuid:6aa1aa8a-a385-4b0c-ae0c-65b191c9389c
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
Key markets, such as automotive, wearables, and internet-of-things (IoT) are spearheading the drive to realize more sophisticated packaging technologies that include the growing use of interposers and 3D ICs. With the goal of improving processing per
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71c937922008cd8486c36ccfd8938c9c
https://doi.org/10.1109/panpacific.2016.7428396
https://doi.org/10.1109/panpacific.2016.7428396
Autor:
Kiyohisa Hasegawa
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 15:254-258
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60576ffc09e4b5639ce5a0485ff34a7a
https://doi.org/10.5104/jiep.15.254
https://doi.org/10.5104/jiep.15.254
Autor:
Takashi Kamigaki, Masahiro Yamamoto, Shinsuke Morita, Hidehumi Ishida, Shiroh Takase, Kiyohisa Hasegawa, Osamu Ohashi, Yoichi Saitoh
Publikováno v:
The journal of the Japanese Practical Surgeon Society. 56:2371-2375
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::568c7d71b7d32e844def4b008010164f
https://doi.org/10.3919/ringe1963.56.2371
https://doi.org/10.3919/ringe1963.56.2371