Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Kiyoharu Mori"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
° A physical vapor deposition (PVD) formed WNi thinfilm over M1 (metal level 1) after its revealing in the via-last through-Si-via (TSV) process has been investigated for its ability in protecting the M1 metal during electroless (EL) plating of barr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::092973e40ca8349c2f4666e87c1c9d4e
https://doi.org/10.1109/ectc32696.2021.00060
https://doi.org/10.1109/ectc32696.2021.00060
Autor:
Makoto Motoyoshi, Takafumi Fukushima, Mitsumasa Koyanagi, Ai Nakamura, Yisang Lee, Jichoel Bea, Shigeru Watariguchi, Kiyoharu Mori, Murugesan Murugesan
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Si interposer with 10 μm-width, 100 μm-deep through-silicon via (TSV) has been fabricated using electroless (EL) Ni as barrier and seed layers, and characterized for their electrical resistance. The chemistry of electroless-Ni plating bath was meti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::809cb139c0fdc1bfb418401c21cc5dfd
https://doi.org/10.1109/ectc.2019.00164
https://doi.org/10.1109/ectc.2019.00164
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
A feasibility study was carried out for self-formation of metal wiring between LSI chips containing ultrafine-pitch Cu landing pads by employing a new concept of directed self-assembly (DSA) phenomena. Preliminary results suggest that it is highly fe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e09f7c698c64d1e9d69b51921293c1fc
https://doi.org/10.23919/ltb-3d.2017.7947440
https://doi.org/10.23919/ltb-3d.2017.7947440
Publikováno v:
Pathology International. 5:1-19
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abf5fce2932d44575dbce0733fba2635
https://doi.org/10.1111/j.1440-1827.1955.tb01727.x
https://doi.org/10.1111/j.1440-1827.1955.tb01727.x
Publikováno v:
Pathology International. 5:77-95
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3c29c54cac7a0ea0c89a389de234629
https://doi.org/10.1111/j.1440-1827.1955.tb01733.x
https://doi.org/10.1111/j.1440-1827.1955.tb01733.x
Publikováno v:
Pathology International. 3:44-51
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::223c581e5dcaba9217c8c4c45538e605
https://doi.org/10.1111/j.1440-1827.1953.tb00328.x
https://doi.org/10.1111/j.1440-1827.1953.tb00328.x
Publikováno v:
Pathology International. 3:84-94
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b049d8fb7322accb210e1a137570a9c3
https://doi.org/10.1111/j.1440-1827.1953.tb00332.x
https://doi.org/10.1111/j.1440-1827.1953.tb00332.x
Publikováno v:
Pathology International. 7:211-218
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::678e1e05a36e34ee0ba37448f2edefcd
https://doi.org/10.1111/j.1440-1827.1957.tb00484.x
https://doi.org/10.1111/j.1440-1827.1957.tb00484.x
Publikováno v:
Pathology International. 6:77-98
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7252afc3ee8ab512162ca981b5948883
https://doi.org/10.1111/j.1440-1827.1956.tb01818.x
https://doi.org/10.1111/j.1440-1827.1956.tb01818.x