Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Kiyeong Kim"'
Autor:
Hyeongseok Yoo, Hyangwoo Kim, Hyeon-Tak Kwak, Minkeun Choi, Kyounghwan Oh, Yijoon Kim, Kiyeong Kim, Seungho Lee, Byoung Don Kong, Chang-Ki Baek
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6dc75f091a7256ec0f430d2573d689fb
https://doi.org/10.2139/ssrn.4401746
https://doi.org/10.2139/ssrn.4401746
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 62:682-690
Display modules have become inextricable components in recent mobile platforms; however, displays also represent the most common noise sources contributing to radio-frequency interference (RFI) issues. This paper considers RFI issues caused by power
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9ed39466cbb78e44c61e8cb0edf6f74
https://doi.org/10.1109/temc.2019.2920079
https://doi.org/10.1109/temc.2019.2920079
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:554-561
In mobile platforms, RF interference issues caused by the switched-mode power supply (SMPS) ringing noise often arise in the on-the-go mode and the charging mode of the interface power management integrated circuits. In this paper, we introduce the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b09330140f968ec2679a0a52e7b5e492
https://doi.org/10.1109/tcpmt.2018.2799330
https://doi.org/10.1109/tcpmt.2018.2799330
Publikováno v:
IEEE Electromagnetic Compatibility Magazine. 5:112-116
Injection of the voltage noise into the PDN is so difficult due to the impedance mismatching between the PDN and connector. This paper proposed a triangular-current generator that can inject an artificial current waveform into the PDN and estimate th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3db6e2248cd60f84066dcdc7b1737c6
https://doi.org/10.1109/memc.2016.7866248
https://doi.org/10.1109/memc.2016.7866248
Autor:
Xiao Li, David Pommerenke, James L. Drewniak, Liangqi Gui, Bruce Archambeault, Matthew Halligan, Albert E. Ruehli, Xinxin Tian, Kiyeong Kim, Michael Cracraft, Qingxia Li, Samuel Connor
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 57:780-787
Electromagnetic radiation at a production printed circuit board (PCB) midplane connector is studied in this paper. A highly detailed simulation model is constructed and corroborated by comparing measured and simulated results, for both mixed-mode S-p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47f657aa78c4213082f32e2ec7b8b13f
https://doi.org/10.1109/temc.2015.2440372
https://doi.org/10.1109/temc.2015.2440372
Autor:
Jun Ho Lee, Kiyeong Kim, Heegon Kim, Jun So Pak, Joohee Kim, Sumin Choi, Kunwoo Park, Jonghyun Cho, Joungho Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:28-39
In this paper, a novel on-interposer passive equalizer is proposed for chip-to-chip high-speed data transmission on the silicon-based on-interposer channel. The proposed equalizer uses the parasitic resistance and inductance of the on-interposer shun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09c3ff53c9027ae50e8cc9a4db768436
https://doi.org/10.1109/tcpmt.2014.2364621
https://doi.org/10.1109/tcpmt.2014.2364621
Publikováno v:
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
In mobile platforms, the 3-level buck converters are newly adopted in IF PMICs to support the fast charging mode. Despite the new adoption, we cannot avoid the ringing noises at the switch transitions which cause significant RFI issues in mobiles. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8468e281d090b9b82ef9b360a6324c65
https://doi.org/10.1109/apemc.2017.7975469
https://doi.org/10.1109/apemc.2017.7975469
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this paper, silicon/glass/organic interposers for 2.5D/3D interconnects are investigated for signal integrity analysis. As total system bandwidth increases, memory industry has been developed to satisfy its requirements. Therefore, High Bandwidth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ef71447cb1b661cce8a8eaba1e1b79e
https://doi.org/10.1109/ectc.2017.160
https://doi.org/10.1109/ectc.2017.160
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:1891-1906
In this paper, we propose models for large-sized silicon interposer power distribution networks (PDNs) and through silicon via (TSV)-based stacked grid-type PDNs using a segmentation method. We model the PDNs as distributed scalable resistance (R), i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b044dc2861d55533e111b63db500689
https://doi.org/10.1109/tcpmt.2013.2276050
https://doi.org/10.1109/tcpmt.2013.2276050
Autor:
Jun So Pak, Kunwoo Park, Kyoungchoul Koo, Kiyeong Kim, Heegon Kim, Jonghyun Cho, Joungho Kim, Chulsoon Hwang, Hyungdong Lee, Jun Ho Lee
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:2057-2070
In this paper, we propose a model for 3-D stacked on-chip power distribution networks (PDNs) in through silicon via (TSV)-based 3-D memory ICs that includes the effects of power/ground TSVs (P/G TSVs), on-chip decoupling capacitors (on-chip decaps),
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6da74dd9787d0d579d2488a5f648b24b
https://doi.org/10.1109/tcpmt.2012.2214482
https://doi.org/10.1109/tcpmt.2012.2214482