Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Kiril Kalkandjiev"'
Publikováno v:
Biomedical Microdevices. 11:755-761
The standard TopSpot technology has been successfully used in the recent years for the highly parallel nanoliter dispensing of bio-chemical substances for microarray printing. It is based on a pneumatically actuated printhead which enables non-contac
Publikováno v:
2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS).
We describe the hybrid fabrication of silicon-plastic microfluidic chips based on machining of Cyclic Olefin Copolymer (COC), standard silicon processing and TMMF lithography. The combination of different processes enables an individual material sele
Publikováno v:
2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS).
This paper describes a process sequence for the fabrication of all-polymer microfluidic chips based on the multilayer lamination of TMMF dry resist (TOK, Japan) on a pre-patterned PMMA substrate. The sequence provides a simple way to meet major micro
Publikováno v:
Journal of Micromechanics and Microengineering. 25:025008
This work presents the microfabrication and experimental evaluation of a dispenser chip, designed for isolation and printing of single cells by combining impedance sensing and drop-on-demand dispensing. The dispenser chip features 50 × 55 µm (width
Autor:
Ludwig Gutzweiler, Roland Zengerle, Claas Müller, Holger Reinecke, N. Wangler, F Mayenfels, Nils Paust, Kiril Kalkandjiev
Publikováno v:
Journal of Micromechanics and Microengineering. 21:095009
We demonstrate the use of photosensitive epoxy laminate TMMF S2045 for the fabrication and sealing of tapered microfluidic channels. The 45 μm thick resist enables the fabrication of shallow sealed cavities featuring extreme aspect ratios of less th
Autor:
Peter Koltay, Ludwig Gutzweiler, Kiril Kalkandjiev, L. Riegger, M Welsche, D. Kosse, Roland Zengerle
Publikováno v:
Journal of Micromechanics and Microengineering. 21:025008
We investigate TMMF photopolymer as a cost-efficient alternative to glass for the leak-tight sealing of high-density silicon microchannels. TMMF enables low temperature sealing and access to structures underneath via lamination and standard UV-lithog
Publikováno v:
Journal of Micromechanics & Microengineering; Feb2015, Vol. 25 Issue 2, p1-1, 1p