Zobrazeno 1 - 10
of 1 147
pro vyhledávání: '"King WP"'
Autor:
Chen S; Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., Zhang Y; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., King WP; Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., Bashir R; Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.; Department of Bioengineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., van der Zande AM; Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.; Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Sep; Vol. 36 (39), pp. e2313694. Date of Electronic Publication: 2024 Jul 18.
Autor:
Lim J; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Koprowski K; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Stavins R; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Xuan N; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Hoang TH; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Baek J; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Kindratenko V; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Khaertdinova L; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Kim AY; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Do M; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., King WP; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Valera E; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Carl R. Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States., Bashir R; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Department of Biomedical and Translational Sciences, Carle Illinois College of Medicine, Urbana, Illinois 61801, United States.; Carl R. Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.; Chan Zuckerberg Biohub Chicago, Chicago, Illinois 60642, United States.
Publikováno v:
ACS sensors [ACS Sens] 2024 Aug 23; Vol. 9 (8), pp. 4058-4068. Date of Electronic Publication: 2024 Aug 05.
Autor:
Wu Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Rytkin E; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Bimrose M; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Choi YS; Department of Materials Science and Engineering, Yonsei University, Seodaemun-gu, Seoul, 03722, Republic of Korea., Lee G; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Wang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Tang L; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Madrid M; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Wickerson G; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Chang JK; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Wearifi Inc, Evanston, IL, 60208, USA., Gu J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Zhang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Liu J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Tawfick S; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., Huang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., King WP; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA., Efimov IR; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Medicine, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA.; Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2023 Dec; Vol. 19 (49), pp. e2305017. Date of Electronic Publication: 2023 Aug 01.
Autor:
Yoo S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Yang T; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA., Park M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Electrical and Computer Engineering, University of California, Davis, CA, 95616, USA., Lee YJ; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Cho D; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Thin Film Materials Research Center, Korea Research Institute of Chemical Technology, Daejeon, 34114, Republic of Korea., Kim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Bionics Research Center of Biomedical Research Division, Korea Institute of Science and Technology, Seoul, 02792, Republic of Korea., Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Bionics Research Center of Biomedical Research Division, Korea Institute of Science and Technology, Seoul, 02792, Republic of Korea., Shin J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Park Y; Department of Advanced Materials Engineering for Information and Electronics, Kyung Hee University, Yongin, 17104, Republic of Korea., Wang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Miljkovic N; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA., King WP; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA. wpk@illinois.edu., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA. jrogers@northwestern.edu.
Publikováno v:
Nature communications [Nat Commun] 2023 Feb 23; Vol. 14 (1), pp. 1024. Date of Electronic Publication: 2023 Feb 23.
Autor:
Park M; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Yoo JY; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Yang T; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801., Jung YH; Department of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea., Vázquez-Guardado A; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208., Kim JH; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Shin J; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Maeng WY; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Lee G; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Yoo S; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Luan H; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Kim JT; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Shin HS; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Flavin MT; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Yoon HJ; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208., Miljkovic N; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208., King WP; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL 61801., Rogers JA; Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611.
Publikováno v:
Proceedings of the National Academy of Sciences of the United States of America [Proc Natl Acad Sci U S A] 2023 Feb 07; Vol. 120 (6), pp. e2217828120. Date of Electronic Publication: 2023 Jan 30.
Autor:
Jankelow AM; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Lee H; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Wang W; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Hoang TH; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Bacon A; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Sun F; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Chae S; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Kindratenko V; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Koprowski K; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Stavins RA; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Ceriani DD; Gener8, LLC, Carlsbad, CA 92011, USA., Engelder ZW; Gener8, LLC, Carlsbad, CA 92011, USA., King WP; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Do MN; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Bashir R; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Center for Genomic Diagnostics, Woese Institute for Genomic Biology, Urbana, IL 61801, USA., Valera E; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Cunningham BT; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr Micro and Nanotechnology Lab, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Center for Genomic Diagnostics, Woese Institute for Genomic Biology, Urbana, IL 61801, USA.
Publikováno v:
The Analyst [Analyst] 2022 Aug 22; Vol. 147 (17), pp. 3838-3853. Date of Electronic Publication: 2022 Aug 22.
Autor:
Ho JY; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.; Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore., Rabbi KF; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA., Khodakarami S; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA., Sett S; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA., Wong TN; Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore., Leong KC; Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore., King WP; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA., Miljkovic N; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.; International Institute for Carbon Neutral Energy Research (WPI-I2CNER), Kyushu University, 744 Moto-oka, Nishi-ku, Fukuoka, 819-0395, Japan.
Publikováno v:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2022 Aug; Vol. 9 (24), pp. e2104454. Date of Electronic Publication: 2022 Jul 03.
Autor:
Lim J; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. wpk@illinois.edu., Stavins R; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Kindratenko V; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu., Baek J; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. wpk@illinois.edu.; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Wang L; Veterinary Diagnostic Laboratory and Department of Veterinary Clinical Medicine, University of Illinois at Urbana-Champaign, Urbana, IL, USA., White K; Department of Biomedical and Translational Sciences, Carle Illinois College of Medicine, Urbana, IL 61801, USA.; Carle Foundation Hospital, Urbana, Illinois 61801, USA., Kumar J; Department of Biomedical and Translational Sciences, Carle Illinois College of Medicine, Urbana, IL 61801, USA.; Carle Foundation Hospital, Urbana, Illinois 61801, USA., Valera E; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. wpk@illinois.edu., King WP; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. wpk@illinois.edu.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Biomedical and Translational Sciences, Carle Illinois College of Medicine, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Bashir R; Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. evalerac@illinois.edu.; Nick Holonyak Jr. Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. wpk@illinois.edu.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Department of Biomedical and Translational Sciences, Carle Illinois College of Medicine, Urbana, IL 61801, USA.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.; Carl R. Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Publikováno v:
Lab on a chip [Lab Chip] 2022 Mar 29; Vol. 22 (7), pp. 1297-1309. Date of Electronic Publication: 2022 Mar 29.
Autor:
Li N; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, United States., Zhao B; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States., Stavins R; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, United States., Peinetti AS; Department of Chemistry, University of Illinois at Urbana-Champaign, United States., Chauhan N; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States., Bashir R; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, United States.; Department of Bioengineering, University of Illinois at Urbana-Champaign, United States., Cunningham BT; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States.; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, United States.; Department of Bioengineering, University of Illinois at Urbana-Champaign, United States., King WP; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States.; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, United States., Lu Y; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Department of Chemistry, University of Illinois at Urbana-Champaign, United States., Wang X; Carle Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, United States.; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States.; Department of Chemistry, University of Illinois at Urbana-Champaign, United States., Valera E; Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, United States.; Department of Bioengineering, University of Illinois at Urbana-Champaign, United States.
Publikováno v:
Current opinion in solid state & materials science [Curr Opin Solid State Mater Sci] 2022 Feb; Vol. 26 (1), pp. 100966. Date of Electronic Publication: 2021 Nov 20.
Autor:
Pandya, S, Wilbur, JD, Bhatia, B, Damodaran, AR, Monachon, C, Dasgupta, A, King, WP, Dames, C, Martin, LW
Publikováno v:
Physical Review Applied, vol 7, iss 3
Pandya, S; Wilbur, JD; Bhatia, B; Damodaran, AR; Monachon, C; Dasgupta, A; et al.(2017). Direct Measurement of Pyroelectric and Electrocaloric Effects in Thin Films. Physical Review Applied, 7(3). doi: 10.1103/PhysRevApplied.7.034025. UC Berkeley: Retrieved from: http://www.escholarship.org/uc/item/4dh4m440
Pandya, S; Wilbur, JD; Bhatia, B; Damodaran, AR; Monachon, C; Dasgupta, A; et al.(2017). Direct Measurement of Pyroelectric and Electrocaloric Effects in Thin Films. Physical Review Applied, 7(3). doi: 10.1103/PhysRevApplied.7.034025. UC Berkeley: Retrieved from: http://www.escholarship.org/uc/item/4dh4m440
© 2017 American Physical Society. An understanding of polarization-heat interactions in pyroelectric and electrocaloric thin-film materials requires that the electrothermal response is reliably characterized. While most work, particularly in electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::b8719e6847466fdbf50af8136f526b66
https://escholarship.org/uc/item/4dh4m440
https://escholarship.org/uc/item/4dh4m440
