Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Kimio Isobe"'
Autor:
Hashimoto Keika, Yu Shoji, Takenori Fujiwara, Yutaro Koyama, Yuki Masuda, Ryoji Okuda, Kimio Isobe, Hitoshi Araki, Masao Tomikawa
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
In this study, we have developed low-temperature curable positive-tone photo-definable dielectric materials with high elongation property for redistribution layers (RDLs). This high elongation concept introduces a flexible molecular skeleton in the b
Autor:
Hitoshi Araki, Yutaro Koyama, Yuki Masuda, Masao Tomikawa, Ryoji Okuda, Yu Shoji, Kimio Isobe, Hashimoto Keika
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
Fan-Out Wafer Level Packages (FOWLPs) and Fan-Out Panel Level Packages (FOPLPs) have been proposed for promising candidates of the advanced packages for multifunctional LSI with many I/O (input/output). FOPLP is expected to reduce the cost of FOWLP b
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Novel Low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongationhave been developed as dielectric layers for copperredistribution layers (RDLs). The posi-PSPIs show lowtemperature curable nature, strong adhesion