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Autor:
Harald Herchen, Hiram Cervera, Timothy Michaelson, Kim Vellore, Lu Chen, Nikolaos Bekiaris, Brian Lue, Junyan Dai
Publikováno v:
Advances in Resist Materials and Processing Technology XXV.
This paper investigates the feasibility of using an electrostatic chuck (ESC) on a post exposure bake (PEB) plate in the track to improve the critical dimension uniformity (CDU) for bowed wafers. Although it is more conventional to consider vacuum ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f75959db2fd4b184953e698a1c123e32
https://doi.org/10.1117/12.772894
https://doi.org/10.1117/12.772894
