Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Kim Shyong Siow"'
Autor:
Abd Samad, Muhammad Izzuddin, Buyong, Muhamad Ramdzan, Kim, Shyong Siow, Yeop Majlis, Burhanuddin
Publikováno v:
Microelectronics International, 2019, Vol. 36, Issue 2, pp. 45-53.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-06-2018-0037
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:983-989
This study experimentally investigated the whole-life ratcheting behavior of sintered copper joints with consideration of the effects of stress rate, stress amplitude, mean stress, maximum stress, and stress ratio. Deformation of joints under cyclic
Publikováno v:
Sains Malaysiana. 50:239-251
The role of sulfur and its synergistic effects with nitrogen moieties in mediating stem cell proliferation and differentiation has become of interest to the tissue engineering community due to chemical similarities with the glycosaminoglycans found i
Publikováno v:
Sains Malaysiana. 49:3097-3104
Increase in hydrophilicity of the filtration membrane could attribute to the fouling reduction and overall filtration performance. In this study, we employ a surface modification on polyamide (PA) membrane by using plasma polymerization with acrylic
Publikováno v:
2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM).
The continuous search for richer and simpler characterization method leads to the use of 3-D finite element method to complement and visualize the Berkovich nano-indentation on the Sn3.5Ag solder as a mean to characterize their mechanical properties.
Autor:
Kim Shyong Siow, S. T. Chua
Publikováno v:
Metals and Materials International. 26:1404-1414
The sintered silver (Ag) joint has proven to be a suitable die-attach material to be used under the operating conditions of wide bandgap semiconductors because of its high melting point and high thermal and electrical conductivities. However, to bond
Publikováno v:
Materialwissenschaft und Werkstofftechnik. 50:533-538
Autor:
Kim Shyong Siow, S. T. Chua
Publikováno v:
JOM. 71:3066-3075
Sintered silver is a promising die-attach material capable of operating at temperatures of more than 200°C. However, while sintering reliably bonds Ag paste on Ag-plated substrate, reliability studies are needed to understand the behavior of this si
Autor:
Bahman Meyghani, S. Emamian, Christoph Heinzl, Kim Shyong Siow, Mokhtar Awang, Bernhard Plank
Publikováno v:
Materialwissenschaft und Werkstofftechnik. 50:234-239
Publikováno v:
Journal of Materials Science: Materials in Electronics. 30:6212-6223
Sintered silver joint has been reported as the front-runner for Pb-free die attach joints for high temperature applications. In this study, micron-Ag and nano-Ag paste were sintered in either air or nitrogen (N2) atmosphere. While sintered silver joi