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pro vyhledávání: '"Kim, KyungOe"'
Autor:
Kim KyungOe, Wagno Alves Braganca
Publikováno v:
International Symposium on Microelectronics. 2020:000106-000112
The action of checking whether the laser beam and die are aligned during laser-assisted bonding process is referred to as die-beam alignment. The current method for die-beam alignment is a simple visual inspection by naked eye, which makes this metho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72d3d75c5153319cc27b43972c3fbbc3
https://doi.org/10.4071/2380-4505-2020.1.000106
https://doi.org/10.4071/2380-4505-2020.1.000106
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Laser-assisted bonding (LAB) is the next generation flip-chip bonding technology that can overcome the limitations of the mass reflow process. The heating mechanism of the LAB process is based on the absorption of the laser's energy by a target mater
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26e5c7e9aa8f3c8355afcfc2fcd627c9
https://doi.org/10.1109/eptc50525.2020.9315012
https://doi.org/10.1109/eptc50525.2020.9315012
Akademický článek
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Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p50-55, 6p
Autor:
Ouyang, Eric, Ahn, Billy, Bornoff, Robin, He, Weikun, Islam, Nokibul, Kim, Gwang, Kim, KyungOe, Vass-Varnai, Andras
Publikováno v:
29th IEEE Semiconductor Thermal Measurement & Management Symposium; 2013, p76-84, 9p
Autor:
Eslampour, Hamid, Joshi, Mukul, Kim, KyungOe, Wei, Sun, Chung, JaeHan, Lee, TaeWoo, Choi, HangChul, Emigh, Roger
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p949-954, 6p