Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Kil Jin Han"'
Autor:
Yeong Cheul Kim, Won-Jae Lee, Hi Deok Lee, Yong-Jin Kim, Yu Jeong Cho, Kil Jin Han, Soon Young Oh
Publikováno v:
Key Engineering Materials. :1322-1325
We investigated the effect of SiOcap layer on the thermal stability of nickel and nickel-cobalt silicide by measuring its sheet resistance. The stability of nickel silicide was deteriorated as a function of annealing temperature, while that of nickel
Autor:
Won-Jae Lee, Hi Deok Lee, Agchbayar Tuya, Han Seob Cha, Hee Hwan Ji, Kil Jin Han, Jang Gn Yun, Do−Woo Kim, Yong Jin Kim, Yeong−Cheul Kim, Jin Suk Wang, Yoo Jeong Cho, Soon Young Oh
Publikováno v:
Japanese Journal of Applied Physics. 45:2980-2983
In this study, a highly thermal immune Ni–germanosilicide utilizing a 1%-nitrogen-doped nickel and a Co/TiN double capping layer is proposed for nano-scale complementary metal oxide semiconductor field effect transistors (CMOSFETs). It is shown tha
Autor:
Hi Deok Lee, Yong-Jin Kim, Yeong-Cheol Kim, Won-Jae Lee, Kil Jin Han, Soon Young Oh, Yu Jung Cho
Publikováno v:
MRS Proceedings. 891
In this study, we have investigated the structure of nickel-cobalt silicide to understand its behavior at high temperature. Nickel-cobalt silicide was formed after two-step RTP at 500°C and 700°C respectively. We could observe by TEM that nickel-co