Pre‐bond testing through direct probing of large‐array fine‐pitch micro‐bumps

Autor: Marinissen, Erik Jan, De Wachter, Bart, Kiesewetter, Jörg, Smith, Ken, Franzon, P.D., Marinissen, E.J., Bakir, M.S.

Publikováno v: Handbook of 3D integration: volume 4: design, test, and thermal management, 231-252
STARTPAGE=231;ENDPAGE=252;TITLE=Handbook of 3D integration

In order to obtain acceptable compound stack yields for 2.5D‐ and 3D‐stacked integrated circuits (SICs), there is a need to test the constituting dies before stacking. The non‐bottom dies of these stacks have their functional access exclusively

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1017bf440cf1dcb7aad3dbe0b8a19405
https://doi.org/10.1002/9783527697052.ch11