Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Kidd Lee"'
Publikováno v:
International Symposium on Microelectronics. 2012:001149-001154
The continued drive for miniaturization by mobile applications demands its toll also from packaging. Innovative packages are required to shrink volume and weight of packages. This has led to the development of single layer, coreless and embedded comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a6380d216e6f217e1c476d9d11fcd9c
https://doi.org/10.4071/isom-2012-thp45
https://doi.org/10.4071/isom-2012-thp45
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This is the very first package made by PCB-like process with die-middle concept in the industry, and is named as die-middle ViB-W. ViB is a BGA package with via to electrically interconnect the chip I/O pads to package. The suffix W means the ViB is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7172c0a3f018aaaff9ee2554e244e777
https://doi.org/10.1109/impact.2015.7365199
https://doi.org/10.1109/impact.2015.7365199
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
As die sizes shrink with technology node advances, the area of WLCSP dice is becoming too small to accommodate all of the solder balls required for the dice I/O. One solution to this problem has been Fan Out Wafer Level Packages (FOWLP), which have b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d66c8c8d0ac03b83f9a7a22e56a9b5e
https://doi.org/10.1109/eptc.2012.6507096
https://doi.org/10.1109/eptc.2012.6507096