Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Kian Yeow Gan"'
Autor:
Teck Wah Park, Siew Hoon Ore, Daniel Teh, Kian Yeow Gan, Nathapong Suthiwongsunthorn, Yong Bo Yang, Drake Koh, Michael Gantalao Ti In, Surasit Chungpaiboonpatana, Geraldine Ng, Boon Pek Liew, Jonathan Tamil
Publikováno v:
International Symposium on Microelectronics. 2011:000673-000682
Moldability is a crucial aspect of flip chip technology. It is an increasing challenge to ensure moldability with rapid advances in flip chip technology such as decreasing bump pitch and stand-off height, especially when commercial molded underfill (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::052c3a6a45e9698267f553f6b6dc4006
https://doi.org/10.4071/isom-2011-wp1-paper4
https://doi.org/10.4071/isom-2011-wp1-paper4
Autor:
Kian Yeow Gan, Jonathan Tamil, Surasit Chungpaiboonpatana, Siew Hoon Ore, Nathapong Suthiwongsunthorn
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
We have developed solutions for the quick assessment of the D2-FBGA thermal performance to meet the rising demands for shorter cycle times to provide thermal solutions. D2-FBGA package has multiple devices packaged within the same footprint which can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65b56ef5883793b862d3ebc3e431b27d
https://doi.org/10.1109/eptc.2011.6184512
https://doi.org/10.1109/eptc.2011.6184512
Autor:
Tamil, Jonathan, Siew Hoon Ore, Kian Yeow Gan, Koh, Drake, Ti In, Michael Gantalao, Boon Pek Liew, Teck Wah Park, Ng, Geraldine, Yong Bo Yang, Teh, Daniel, Suthiwongsunthorn, Nathapong, Chungpaiboonpatana, Surasit
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2012 1st Quarter, Vol. 9 Issue 1, p19-30, 12p
Autor:
Ore, Siew Hoon, Kian Yeow Gan, Tamil, Jonathan, Suthiwongsunthorn, Nathapong, Chungpaiboonpatana, Surasit
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p714-721, 8p