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Autor:
Juhoon Yoon, YongHo Son, SeoungJoon Hong, DaeByoung Kang, KiDong Sim, DaeHo Moon, Byong Jin Kim, JinYoung Khim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:31-34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68730bac0aafaf8a9a6a50436bdc113a
https://doi.org/10.6117/kmeps.2016.23.4.031
https://doi.org/10.6117/kmeps.2016.23.4.031
