Zobrazeno 1 - 10
of 71
pro vyhledávání: '"Ki-seok Jang"'
Autor:
Yong-Sung Eom, Gwang-Mun Choi, Ki-Seok Jang, Jiho Joo, Chan-mi Lee, Jin-Hyuk Oh, Seok-Hwan Moon, Kwang-Seong Choi
Publikováno v:
ETRI Journal, Vol 46, Iss 2, Pp 347-359 (2024)
A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solven
Externí odkaz:
https://doaj.org/article/59e765084de140da8c3076a8273977e2
Autor:
Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Publikováno v:
Polymers, Vol 13, Iss 6, p 957 (2021)
An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formu
Externí odkaz:
https://doaj.org/article/c9e6c771182a43b7aa470eac88ba1649
Autor:
Yong‐Sung Eom, Gwang‐Mun Choi, Ki‐Seok Jang, Jiho Joo, Chan‐mi Lee, Jin‐Hyuk Oh, Seok‐Hwan Moon, Kwang‐Seong Choi
Publikováno v:
ETRI Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::205df238abab753029e8fdb11f14ff07
https://doi.org/10.4218/etrij.2022-0471
https://doi.org/10.4218/etrij.2022-0471
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1dabb0f9ba63a083e5cb2059fc3bb575
https://doi.org/10.1109/estc55720.2022.9939437
https://doi.org/10.1109/estc55720.2022.9939437
Autor:
Ho-Gyeong Yun, Ji-Woong Choi, Ki-Seok Jang, Yong-Sung Eom, Kwang-Seong Choi, Seok Hwan Moon, Gwang-Mun Choi, Chanmi Lee, Jiho Joo, Ji-Hoon Choi
Publikováno v:
SID Symposium Digest of Technical Papers. 52:841-844
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::979ef0fd9a1fa989c2983b30c6dcb2d5
https://doi.org/10.1002/sdtp.14814
https://doi.org/10.1002/sdtp.14814
Autor:
In-Seok Kye, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-Seok Jang, Yong-Sung Eom, Kwang-Seong Choi, Yong-Jun Oh
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02e763e1b24a4e70cfc9cc625ffee2cc
https://doi.org/10.1109/ectc51906.2022.00190
https://doi.org/10.1109/ectc51906.2022.00190
Autor:
Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Yong-Sung Eom, In-Seok Kye, Ki-Seok Jang, Seok Tae Hwang, Jeong Duck Kim, Kwang-Seong Choi
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::543a6748176a5a9c053e0ab68924a508
https://doi.org/10.1109/ectc51906.2022.00104
https://doi.org/10.1109/ectc51906.2022.00104
Autor:
Kwang-Seong Choi, Jiho Joo, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Ki-seok Jang, Chanmi Lee, Jin-Hyuk Oh, In-Seok Kye, Yoon-Hwan Moon, Yong-Sung Eom
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aae1e772606cce0eecc6225c0b6a57eb
https://doi.org/10.1109/ectc51906.2022.00042
https://doi.org/10.1109/ectc51906.2022.00042
Autor:
Jiho Joo, Ho-Gyeong Yun, Ki-Seok Jang, Gwang-Mun Choi, Chanmi Lee, Yong-Sung Eom, Seok Hwan Moon, Ji-Woong Choi, Kwang-Seong Choi, Ji-Hoon Choi
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The transfer process of moving individual micro-LED chips to a display substrate has been regarded as the biggest technical obstacle for the commercialization of displays based on micro-LEDs. To date, various candidate technologies have not been able
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f8276a345a31b592bc1575eeae6c582
https://doi.org/10.1109/ectc32696.2021.00255
https://doi.org/10.1109/ectc32696.2021.00255
Autor:
Jiho Joo, Yong-Sung Eom, Gwang-Mun Choi, Ho-Gyeong Yun, Kwang-Seong Choi, Seok Hwan Moon, In-seok Kye, Chanmi Lee, Ki-Seok Jang
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We have transferred and bonded a $\mu \text{LED}$ array to the patterned substrate using SITRAB (Simultaneous transferring and bonding) and ASP (Anisotropic Solder Paste). ASP contained epoxy as a base matrix, solder powder, and a small fraction of p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d10ea2e5c627e083729b38f3dc45b1f0
https://doi.org/10.1109/ectc32696.2021.00119
https://doi.org/10.1109/ectc32696.2021.00119