Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Ki-Jun Sung"'
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29e378a873580b6812140ee0419102c7
https://doi.org/10.1109/edtm55494.2023.10102966
https://doi.org/10.1109/edtm55494.2023.10102966
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f4d0a52634faac92ee9f5c9011c6ac7
https://doi.org/10.1109/ectc51906.2022.00217
https://doi.org/10.1109/ectc51906.2022.00217
Publikováno v:
ETRI Journal. 34:706-712
In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77683d935430500c7f73aa1b64f7f027
https://doi.org/10.4218/etrij.12.0112.0104
https://doi.org/10.4218/etrij.12.0112.0104
Autor:
Yong-Sung Eom, Kwang-Seong Choi, Jong-Jin Lee, Hyun-Cheol Bae, Ki-Jun Sung, Jong-Tae Moon, Byeong-Ok Lim, Sun-Woo Chu
Publikováno v:
ETRI Journal. 33:637-640
A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip- chip bonding. The functions of the resin are carrying solder powder and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51ac041fdf6b5a78c1550908a39ae870
https://doi.org/10.4218/etrij.11.0210.0298
https://doi.org/10.4218/etrij.11.0210.0298
Autor:
Ki-Jun Sung, Sunghae Jung, Byeong-Ok Lim, Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, Jong-Tae Moon
Publikováno v:
ETRI Journal. 32:342-344
A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and lowmelting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a30aae479f9e2bb8d39d1c31130922d
https://doi.org/10.4218/etrij.10.0209.0396
https://doi.org/10.4218/etrij.10.0209.0396
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed to make solder bumps on TSVs. With the coining process, the standard deviation of bump heig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c41ad516e14218fcb1969a15dac02b0
https://doi.org/10.1109/ectc.2011.5898748
https://doi.org/10.1109/ectc.2011.5898748
Autor:
Ki-Jun Sung, Yong-Sung Eom, Kwang-Seong Choi, Jong-Tae Moon, Hyun-Cheol Bae, Eun Soo Nam, Byeong-Ok Lim, Yong-Hwan Kwon, Sun-Woo Choo
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
The electroplating and screen printing are widely used in the micro-electric industry but they have disadvantages of a complicated series of bumping process, equipments and materials. Furthermore, they are not suitable for the fine pitch bumping tech
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8bbd98f910f669b0213f4ba7aac737d
https://doi.org/10.1109/icept.2010.5582448
https://doi.org/10.1109/icept.2010.5582448
Autor:
Byeong-Ok Lim, Ki-Jun Sung, Sun-Woo Choo, Hyun-Chel Bae, Yong-Sung Eom, Kwang-Seong Choi, Jong-Jin Lee, Jong-Tae Moon
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 µm pitch, there are many candidates. The cost-effectiveness will be one of the major
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f550fddb7fb1fb9df99d49ffb3d1992
https://doi.org/10.1109/icept.2010.5582689
https://doi.org/10.1109/icept.2010.5582689
Autor:
Ki-Jun Sung, Yong-Sung Eom, Hyun-Cheol Bae, Byeung-Gee Kim, Sunghae Jung, Jong-Tae Moon, Byeong-Ok Lim, In-Soo Kang, Kwang-Seong Choi
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
In this paper, a 3D system in package (SiP) module using through silicon vias (TSV) and novel solder bump maker (SBM) has been presented. The SBM is a paste material which is composed of the solder powder and polymer resin. The polymer resin had the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49e2a7a79f0b1d99b808f92cef23f41a
https://doi.org/10.1109/ectc.2010.5490765
https://doi.org/10.1109/ectc.2010.5490765
Autor:
Jong Tae Moon, Ki-Jun Sung, Byeong-Ok Lim, Yong Sung Eom, Sunghae Jung, Kwang-Seong Choi, Hyun-Cheol Bae
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Bumping processes like the controlled collapse chip connect new process (C4NP) and the immersion solder bumping process for a fine pitch bumping have the disadvantages of the complicated series of process and the possibility of the reliability proble
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edfc454e5c191e58f43f67555f03aa6b
https://doi.org/10.1109/eptc.2009.5416483
https://doi.org/10.1109/eptc.2009.5416483