Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Ki Deok Bae"'
Autor:
Jong Woo Hong, Yeon Hee Kim, Hee Ju Kim, Hyun Woo Tak, Soo Nam Goong, Seong Bae Kim, Ki Deok Bae, Jeong Yub Lee, Hae Soo Bae, Geun Young Yeom, Dong Woo Kim
Publikováno v:
Materials Science in Semiconductor Processing. 164:107617
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::411c5fc5db9a0a16fb1b5e737edefbb1
https://doi.org/10.1016/j.mssp.2023.107617
https://doi.org/10.1016/j.mssp.2023.107617
Autor:
Jong Woo Hong, Yeon Hee Kim, Hee Ju Kim, Hyun Woo Tak, Ki Deok Bae, Jeong Yub Lee, Hae Soo Bae, Yong Su Kim, Geun Young Yeom
Publikováno v:
Vacuum. 212:111978
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c0734f9d5b075082289e5fc977c4829
https://doi.org/10.1016/j.vacuum.2023.111978
https://doi.org/10.1016/j.vacuum.2023.111978
Autor:
Yong Young Park, Chang Seung Lee, Jaekwan Kim, Kunmo Chu, Wenxu Xianyu, Yoonchul Sohn, Ki Deok Bae, Byong Gwon Song
Publikováno v:
Applied Surface Science. 453:31-36
Thin-film encapsulation (TFE) is of great importance as a barrier film to protect organic devices and displays. A serious problem with the application of TFE is degradation of organic devices with penetration of oxygen and water vapor through pinhole
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57e9c0201234f927fa2c3af3be36a8b6
https://doi.org/10.1016/j.apsusc.2018.05.072
https://doi.org/10.1016/j.apsusc.2018.05.072
Autor:
Gae Hwang Lee, Seon-Jeong Lim, Kyung-Bae Park, Ryuichi Satoh, Yong-young Park, Yeon-hee Kim, Sang Yoon Lee, Ki-deok Bae, Takkyun Ro, Wenxu Xianyu, Chul-Joon Heo, Yong Wan Jin, Dong-Seok Leem, Xavier Bulliard, Woo-Yong Yang, Jong-Bong Park
Publikováno v:
Organic Electronics. 41:259-265
A novel approach for the thin film encapsulation (TFE) of organic photo-diode (OPD) for the next generation of organic/inorganic hybrid complementary metal oxide semiconductor (CMOS) image sensor is reported. The TFE is composed of two different meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e7780670400c83436e1da2e137ad278
https://doi.org/10.1016/j.orgel.2016.11.013
https://doi.org/10.1016/j.orgel.2016.11.013
Autor:
Yong Young Park, Ki Deok Bae, Byong Gwon Song, Wenxu Xianyu, Jaekwan Kim, Kunmo Chu, Chang Seung Lee
Publikováno v:
International Symposium on Microelectronics. 2016:000272-000276
In this study, thin SiON was grown by plasma enhanced chemical vapor deposited (PECVD) method as a thin-film encapsulation (TFE) layer. For defect visualization, electroplating results in a Cu bump grown at each defect site in the SiON film where ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::526a645b2f60e1ff08599736ae0ae375
https://doi.org/10.4071/isom-2016-wp15
https://doi.org/10.4071/isom-2016-wp15
Autor:
Jungkwuen An, Kanghee Won, Hoon Song, Jong-Young Hong, Chil-Sung Choi, Byong-Gwon Song, Yunhee Kim, Ki-deok Bae, Young Keun Kim, Jinwook Burm, Hong-Seok Lee, Hong Suk Kim
Publikováno v:
Applied Optics. 59:7462
A slim beam deflector that satisfies both a large steering angle and a large area can be very useful in various applications. However, a smaller electrode pitch for a large steering angle and enlargement of its area are trade-off relations due to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::31da10b2b0516eadd4c9dd16e275026a
https://doi.org/10.1364/ao.398863
https://doi.org/10.1364/ao.398863
Publikováno v:
Microelectronic Engineering. :158-163
A new thermal inkjet printer head on SOI wafer was proposed. It was composed of two rectangular heaters with same size. So we could call it T-jet (Twin jet). As it uses the back shooting mechanism, the ejected ink's direction is the opposite directio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a37be0c1613ead74e4d70310dcea9dc0
https://doi.org/10.1016/j.mee.2005.01.020
https://doi.org/10.1016/j.mee.2005.01.020
Autor:
C.-H. Cho, Hoon Song, Ki-deok Bae, Yong-Soo Oh, Soonho Baek, Hyuck Lim, Jong-Woo Shin, Yong-Seok Kim, Chang-Soo Lee, K. Kuk, Su-Ho Shin
Publikováno v:
Sensors and Actuators A: Physical. 114:392-397
A novel thermal inkjet printhead with monolithically fabricated nickel nozzle plate on SOI wafer has been proposed for the first time. A chamber and a restrictor are implemented on the 40 μm thick top silicon layer, and a nozzle plate covering heate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3698e32277b0bdf1a39fe2862e14f011
https://doi.org/10.1016/j.sna.2003.12.023
https://doi.org/10.1016/j.sna.2003.12.023
Publikováno v:
Journal of Micromechanics and Microengineering. 13:922-926
We have proposed a new type of electrostatic actuator for optical switching which has trench structure to make low voltage driving possible. Its lower or fixed electrode consists of a horizontal electrode and an extra vertical one which acts as a sto
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::316cf01fc8c3141d4e8ea6282a5ed0a9
https://doi.org/10.1088/0960-1317/13/6/315
https://doi.org/10.1088/0960-1317/13/6/315
Autor:
Jong-Woo Shin, K. Kuk, Yong-Soo Oh, Yongsung Kim, Ki-deok Bae, Seong-Soon Baek, Hyuck Lim, C.-H. Cho, Hoon Song, Chang-Ju Lee, Su-Ho Shin
Publikováno v:
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).
A novel thermal inkjet printhead with monolithically fabricated nickel nozzle plate on SOI wafer has been proposed for the first time. A chamber and a restrictor are implemented on the 40 /spl mu/m thick top-silicon layer, and a nozzle plate covering
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12fb18888012ed1353b15b299a46a8c1
https://doi.org/10.1109/sensor.2003.1215356
https://doi.org/10.1109/sensor.2003.1215356