Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Khin Maung LATT"'
Autor:
Takako Taniguchi, Khin Maung Latt, Hiroyuki Sato, Tomoya Minamino, Naoaki Misawa, Fusae Yano, Elpita Tarigan
Publikováno v:
Microbial Drug Resistance. 27:1450-1454
In a large-scale dairy farm, it is important to take countermeasure of prevention against mastitis of dairy cows, and it is especially important to establish hygiene and risk management to prevent the emergence and spread of antibiotic-resistant bact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49bed25a9a67156d3d6d173eae03d331
https://doi.org/10.1089/mdr.2020.0481
https://doi.org/10.1089/mdr.2020.0481
Autor:
Byeonghwa Jeon, Khin Maung Latt, Savek Kiatsomphob, Takako Taniguchi, Naoaki Misawa, Elpita Tarigan
Publikováno v:
The Journal of Veterinary Medical Science
Campylobacter jejuni is one of the leading causes of human gastroenteritis in Japan. As chickens and cattle are common reservoirs for C. jejuni, this microaerophilic, stress-sensitive bacterium can overcome and survive various stress conditions durin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f2b3bd238e4d316223101bb7664d8e33
https://doi.org/10.1292/jvms.19-0228
https://doi.org/10.1292/jvms.19-0228
Publikováno v:
The Journal of Veterinary Medical Science
Campylobacter jejuni and C. coli are the leading causes of enteric infections in many developed countries. Healthy chickens are considered to act as reservoirs of campylobacters, as the organisms colonize the intestinal tract. Once infected birds ent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94f59071eaa08ccba7f3c8c0afe2bb74
https://pubmed.ncbi.nlm.nih.gov/29151444
https://pubmed.ncbi.nlm.nih.gov/29151444
Autor:
Savek KIATSOMPHOB, Takako TANIGUCHI, Elpita TARIGAN, Khin Maung LATT, Byeonghwa JEON, Naoaki MISAWA
Publikováno v:
Journal of Veterinary Medical Science; 2019, Vol. 81 Issue 8, p1144-1151, 8p
Publikováno v:
Materials Science and Engineering: B. 94:111-120
The integrity of Cu/Ta/SiO2/Si multilayer structure under nitrogen thermal annealing has been examined by sheet resistance measurement, X-ray diffraction, scanning electron microscopy, secondary ion mass spectroscopy, Rutherford backscattering spectr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0be6437d113992f6c18100ceec142149
https://doi.org/10.1016/s0921-5107(02)00093-4
https://doi.org/10.1016/s0921-5107(02)00093-4
Publikováno v:
Materials Science and Engineering: B. 90:25-33
Microstructure, composition and thermal stability of the SiNx/Cu/Ta/SiO2/Si (hereinafter ‘passivated’) multi-layer sample were investigated after annealing at different temperatures and compared with those of the Cu/Ta/SiO2/Si (hereinafter ‘unp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bcdd4d0699fa0fdeb6297dcafe0e6cb
https://doi.org/10.1016/s0921-5107(01)00746-2
https://doi.org/10.1016/s0921-5107(01)00746-2
Autor:
Harold S. Park, Weiguang Zhu, Thomas Osipowicz, Khin Maung Latt, Sean Li, Yuan-Kun Lee, Liu Rong
Publikováno v:
Journal of Materials Science. 37:1941-1949
This work investigated the diffusion barrier properties of ionized metal plasma (IMP) deposited Ta between Cu and SiO2. When Cu and Ta layers were formed by IMP sputtering, it was found that the Cu has the equilibrium f.c.c. structure with the grain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36b58a8455140223dd5d81b8affed562
https://doi.org/10.1023/a:1015230727381
https://doi.org/10.1023/a:1015230727381
Publikováno v:
Journal of Materials Science. 37:4181-4188
Silicon nitride (SiNx) thin film layers were deposited on Cu/Ta/SiO2/Si multilayer structures by Plasma Enhanced Chemical Vapor Deposition at the temperature 285°C. The influence of post deposition thermal annealing treatments on the micro-structura
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52f6f13cb8dba934afd82fb3624ddc9d
https://doi.org/10.1023/a:1020096021514
https://doi.org/10.1023/a:1020096021514
Publikováno v:
Materials Science and Engineering: B. 84:217-223
This work concentrates on the diffusion barrier stability of very thin tantalum nitride films with different thickness (10, 20 and 30 nm) sputter-deposited on silicon dioxide in the Cu/TaN/SiO2/Si multiplayer structure. The impact of varying layer th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ff234ff888e24cbbfb8130248c618f0
https://doi.org/10.1016/s0921-5107(01)00618-3
https://doi.org/10.1016/s0921-5107(01)00618-3
Publikováno v:
Materials Science and Engineering: B. 83:1-7
The properties of electroplated copper (Cu) film on a thin seed layer of ionized metal plasma deposited Cu have been investigated as a function of annealing temperatures together with the diffusion barrier performance in the EPCu/IMPCu/IMPTaN/SiO 2 /
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93af804aa0dc3bae38d0e9d73aa36265
https://doi.org/10.1016/s0921-5107(00)00544-4
https://doi.org/10.1016/s0921-5107(00)00544-4