Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Khang Choong Yong"'
Autor:
Khang Choong Yong, Raymond Chong
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
A crystal oscillator is widely used in today’s system to generate a stable clock signal for digital integrated circuits and reference clock for Phase Lock Loop. It is one of the most important components in any systems to provide a precise and low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ed7ff951932a61dc54a2f0fe3b3e1c5
https://doi.org/10.1109/eptc.2018.8654299
https://doi.org/10.1109/eptc.2018.8654299
Autor:
Khang Choong Yong, Jackson Chung Peng Kong, Eric Gantner, Stephen H. Hall, Bok Eng Cheah, Chaitanya Sreerama
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
A high-performance and patent-pending [1] interconnect structure for flex circuits is described in this paper. It is termed Guided Interconnect, as its basic principle is to “guide” the electromagnetic wave of high-speed signaling in a closely-co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c372acbbce7c016c9d226fa3a1e6709
https://doi.org/10.1109/eptc.2018.8654337
https://doi.org/10.1109/eptc.2018.8654337
Publikováno v:
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
A novel and high-performance interconnect structure is the core of this work. This patent-pending [1] structure is termed Guided Interconnect (GI), as its basic principle is to “guide” the electromagnetic (EM) wave of highspeed signaling in a tig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49d6ada145ec478f78fa4323041f51cc
https://doi.org/10.1109/iemt.2018.8511655
https://doi.org/10.1109/iemt.2018.8511655
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
A novel and patent-pending [1] routing configuration to address the multi-reflection noise caused by the vertical interconnect viz. plated-through-hole (PTH) is presented in this paper. The PTHs are frequently found in any packaging and printed circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee9a8f317d2da6fd7dd03ecb835f29a
https://doi.org/10.1109/eptc.2017.8277440
https://doi.org/10.1109/eptc.2017.8277440
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
This work describes an innovative low-loss transmission line routing configuration, which enables improved channel margin in next-generation high-speed serial buses beyond 10Gbps applications. One such example is SuperSpeed Plus USB a.k.a. USB 3.1 Ge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bf3147de95348d306177b1f7ed27e1b
https://doi.org/10.1109/eptc.2016.7861534
https://doi.org/10.1109/eptc.2016.7861534
Publikováno v:
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2071f50917288becd672939d0895a3a
https://doi.org/10.1109/isemc.2014.6899001
https://doi.org/10.1109/isemc.2014.6899001
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Multi-chip package (MCP) technology has recently advanced as an alternative packaging solution to enable high performance and power-efficient mobile electronic devices. The wide adoptions of MCP technology are mainly driven by reduced circuit complex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e8ebfcb5539719a89bdb4e7cf96e54a
https://doi.org/10.1109/eptc.2013.6745707
https://doi.org/10.1109/eptc.2013.6745707
Publikováno v:
2012 4th Asia Symposium on Quality Electronic Design (ASQED).
Multi-Chip Package (MCP) is becoming a customary form of integration in many high performance and advanced electronic devices. The vast adoptions of this technology are mainly contributed by advantages for instance lower power consumption, heterogene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15d7de4e7f9e6e2f0980a084be3a714d
https://doi.org/10.1109/acqed.2012.6320509
https://doi.org/10.1109/acqed.2012.6320509
Publikováno v:
2012 4th Asia Symposium on Quality Electronic Design (ASQED); 1/ 1/2012, p243-248, 6p