Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers

Autor: Yann Lamy, Anne-Laure Perrier, Khadim Dieng, Olivier Guiller, Bernard Flechet, Alexis Farcy, Philippe Artillan, Cedric Bermond, Thierry Lacrevaz, Grégory Houzet, Sylvain Joblot

Publikováno v: IEEE Transactions on Components Packaging and Manufacturing Technology Part B
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩

International audience; The feasibility of cointegration of new capacitors, named “through silicon capacitors” (TSCs) with “through silicon vias” in silicon interposers has recently been demonstrated. Two architectures of TSC are extensively

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::47bc48de94b0dad144236ff674e0a8cf
https://doi.org/10.1109/tcpmt.2017.2655939

High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer

Autor: Alexis Farcy, Philippe Artillan, Yann Lamy, Bernard Flechet, Grégory Houzet, Sylvain Joblot, Olivier Guiller, Khadim Dieng, Cedric Bermond, Thierry Lacrevaz

Publikováno v: 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI)
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), May 2016, Turin, Italy. pp.1-4, ⟨10.1109/SaPIW.2016.7496285⟩

The «Through Silicon Vias» technology, developed for silicon interposer interconnects network, has inspired new capacitors components named «Through Silicon Capacitors (TSC)». Two architectures of TSC are studied in this paper: the Single Sided-T

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e49bc7e1a3ff44d592cab57ab5a8fc2d
https://hal.science/hal-01992951

Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network

Autor: Sylvain Joblot, Philippe Artillan, Alexis Farcy, Khadim Dieng, Olivier Guiller, Bernard Flechet, Grégory Houzet, Yann Lamy, Cedric Bermond, Thierry Lacrevaz

Publikováno v: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), May 2015, San Diego, United States. pp.247-253, ⟨10.1109/ECTC.2015.7159600⟩

Inspired from Through Silicon Vias (TSVs), Through Silicon Capacitors (TSCs) are newly developed and integrated throughout silicon interposers. Thanks to the use of the third dimension in the silicon interposer, TSC technology allows to obtain high c

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b34f934e9a60e06295c6c1c4eac4b317
https://hal.science/hal-01992912

Through Silicon Capacitor co-integrated with TSV as an efficient 3D decoupling capacitor solution for power management on Silicon Interposer

Autor: Emmanuel Defay, Sylvain Joblot, Alexis Farcy, Yann Lamy, Olivier Guiller, Khadim Dieng

Publikováno v: IEEE ECTC 2014, 64th Electronic Components and Technology Conference
IEEE ECTC 2014, 64th Electronic Components and Technology Conference, May 2014, Lake Buena Vista, Florida, United States. pp.1-4

First part of this paper discusses decoupling method limitation within the Power Delivery Network of a classical circuit and challenges introduced by 3D integrated circuit in term of power management. Solutions are exposed, such as integration of dec

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c079f8b12d5b4b74eb788bfb69ed1250
https://hal.archives-ouvertes.fr/hal-01021507

High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer.

Autor: Dieng, Khadim, Bermond, Cedric, Artillan, Philippe, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Lamy, Yann, Flechet, Bernard

Publikováno v: 2016 IEEE 20th Workshop on Signal & Power Integrity (SPI); 2016, p1-4, 4p