Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Kewei Zuo"'
89
The main purposes of this study are to establish a hybrid modeling procedure of fermentation systems and to investigate its applications. It is desired to integrate scattered experimental data into useful information with less efforts and low
The main purposes of this study are to establish a hybrid modeling procedure of fermentation systems and to investigate its applications. It is desired to integrate scattered experimental data into useful information with less efforts and low
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/22424731386117881849
Publikováno v:
Biochemical Engineering Journal. 29:81-90
A hybrid model combining hydrodynamic and biological effects is developed to describe the cultivation of Acetobacter xylinum for bacterial cellulose production in a modified airlift reactor with wire-mesh draft tubes. The hydrodynamic part is essenti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e110cee54ee3af0bf02935f10b58743
https://doi.org/10.1016/j.bej.2005.02.020
https://doi.org/10.1016/j.bej.2005.02.020
Publikováno v:
IFAC Proceedings Volumes. 31:51-54
Fed-batch culture has been commonly employed in fermentation process. The main concern of fed-batch culture is the feeding strategy for improving the fermentation performance. This work is to determine the optimal feeding for fed-batch culture in pen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::198c863f64831ad2cd542b7d88e28a75
https://doi.org/10.1016/s1474-6670(17)40158-3
https://doi.org/10.1016/s1474-6670(17)40158-3
Publikováno v:
ISQED
Boning
Boning
Advanced CMOS processes need new methodologies to extract, characterize and model process variations and their sources. Most prior studies have focused on understanding the effect of local layout features on transistor performance; limited work has b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::42186d5be3a3ba527eb8c89f40299315
https://doi.org/10.1109/isqed.2012.6187493
https://doi.org/10.1109/isqed.2012.6187493
Publikováno v:
Boning
ISQED
ISQED
As continued scaling becomes increasingly difficult, 3D integration with through silicon vias (TSVs) has emerged as a viable solution to achieve higher bandwidth and power efficiency. Mechanical stress induced by thermal mismatch between TSVs and the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94a6eba9398163095d5ac8d43ab618f6
https://orcid.org/0000-0002-0417-445X
https://orcid.org/0000-0002-0417-445X
Publikováno v:
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846).
A framework for improving alarm performance is proposed and a more detailed flowchart is also described in this paper. Alarm systems are complicated and the improvement requires long-term efforts. The proposed procedure has reduced unnecessary alarms
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c26964f0aaa47e96d9423f6cecbb48a3
https://doi.org/10.1109/smtw.2004.1393751
https://doi.org/10.1109/smtw.2004.1393751
Publikováno v:
2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846); 2004, p145-148, 4p