Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Kevin Krohnert"'
Autor:
Ha-Duong Ngo, Biswajit Mukhopadhyay, Piotr Mackowiak, Kevin Kröhnert, Oswin Ehrmann, Klaus-Dieter Lang
Publikováno v:
Micromachines, Vol 7, Iss 10, p 193 (2016)
In this paper, we present and discuss our new WSi–WSiN–Pt metallization scheme for SiC-based microsystems for applications in harsh environments. Stoichiometric material WSi was selected as contact material for SiC. The diffusion barrier material
Externí odkaz:
https://doaj.org/article/d536392349144da5af29876b0fc09a7a
Autor:
Tobias Chaloun, Susanne Brandl, Norbert Ambrosius, Kevin Krohnert, Holger Maune, Christian Waldschmidt
Publikováno v:
IEEE Journal of Microwaves, Vol 3, Iss 2, Pp 783-799 (2023)
Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems w
Externí odkaz:
https://doaj.org/article/feeea0e6ce36411c9a26dad6e545c739
Autor:
Thomas Galler, Tobias Chaloun, Winfried Mayer, Kevin Krohnert, Dzmitry Starukhin, Norbert Ambrosius, Malte Schulz-Ruhtenberg, Christian Waldschmidt
Publikováno v:
IEEE Journal of Microwaves, Vol 2, Iss 1, Pp 97-107 (2022)
This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading t
Externí odkaz:
https://doaj.org/article/f29ac75363aa4cdcb2240d7a9c967186
Autor:
Thomas Galler, Tobias Chaloun, Winfried Mayer, Kevin Krohnert, Norbert Ambrosius, Malte Schulz-Ruhtenberg, Christian Waldschmidt
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. :1-11
Autor:
Parnika Gupta, Padraic E. Morrissey, Peter O' Brien, Kevin Krohnert, Markus Wohrmann, Michael Schiffer, Christian Kelb, Norbert Ambrosius, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Autor:
Kai Zoschke, Hermann Oppermann, Markus Wohrmann, Christine Kallmayer, Christian Tschoban, Kevin Krohnert, Christina Lopper, Danny Jaeger, Mario Lutz, Olaf Wunsch
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Ulli Hansen, Martin Schneider-Ramelow, Thomas Galler, Michael Schiffer, Dzmitry Starukhin, Tobias Chaloun, Norbert Ambrosius, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Winfried Mayer, Kevin Krohnert, Georg Friedrich, Markus Wohrmann
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this work, we present the realized versatile hermetically sealed sensor packaging platform based on glass interposers which is applicable in industrial metrology, MEMS, photonics, life sciences and process automation application, among others. The
Autor:
Kevin Krohnert, Georg Friedrich, Martin Schneider-Ramelow, Markus Wohrmann, Michael Schiffer, Dzmitry Starukhin
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
In this work we present aspects of our versatile hermetically sealed sensor platform. The sealed glass package can include passive and active devices (radar, pressure, infrared sensors). Glass is used due to its ideal properties for such applications
Autor:
N. Jurgensen, Alexander Goritz, Selin Tolunay Wipf, Mehmet Kaynak, Matthias Wietstruck, Kai Zoschke, Klaus-Dieter Lang, Kevin Krohnert, Hermann Oppermann, Piotr Mackowiak
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This article describes a new wafer level capping technology for hermetic or quasi-hermetic 1st level device sealing. The technology is based on fabrication of cap structures with bond frames and optional recesses at temporary carrier wafers and their
Autor:
Malte Schulz-Ruhtenberg, Thomas Galler, Christian Waldschmidt, Kevin Krohnert, Tobias Chaloun
A novel hermetically sealed RF packaging concept based on glass is presented. Using the laser induced deep etching (LIDE) technology enables the fabrication of glass vias without degrading the mechanical stability as micro-cracks are completely avoid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7301f415e049dd24ba7d3ddd2ff1a4d8