Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Kevin Fealey"'
Autor:
Milica Notaros, Thomas Dyer, Andres Garcia Coleto, Ashton Hattori, Kevin Fealey, Seth Kruger, Jelena Notaros
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-8 (2024)
Abstract The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabrication processes being demonstrated at both infrared and visible wavelengths. However, these demonstrations h
Externí odkaz:
https://doaj.org/article/8ce61381b20047ffaceb71c2d91bc2e4
Publikováno v:
Frontiers in Optics + Laser Science 2022 (FIO, LS).
We develop a wafer-scale CMOS-compatible platform and fabrication process that results in 300-mm-diameter flexible wafers, and experimentally demonstrate key functionality at visible wavelengths, including chip coupling, waveguide routing, and passiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cca384dfaaec7102a47d4f34c4c8eccb
https://doi.org/10.1364/fio.2022.fw1e.3
https://doi.org/10.1364/fio.2022.fw1e.3
Autor:
Gyanaranjan Pattanaik, Peter Reilly, Anh Nguyen, Jack Enloe, Michael Flynn, Alison Gracias, Kevin Fealey, Fred Wafula
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:43-48
This study addresses the impact of bath stability on electroplated copper for through-silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities, and other properties of the copper produced were characterized using an arr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6631544989131d3e371b898c9182a57f
https://doi.org/10.4071/imaps.448
https://doi.org/10.4071/imaps.448
Autor:
Anh Nguyen, Jack Enloe, Fred Wafula, Kevin Fealey, Peter Reilly, Alison Gracias, Gyanaranjan Pattanaik, Michael Flynn
Publikováno v:
International Symposium on Microelectronics. 2014:000013-000018
This study addresses the impact of bath stability on electroplated copper for through silicon via (TSV) in a controlled manufacturing environment. Microstructure, impurities and other properties of the copper produced were characterized using an arra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8fa5d5bc7d6376b6d6e74ab2606b181
https://doi.org/10.4071/isom-ta13
https://doi.org/10.4071/isom-ta13