Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Ketul B. Sutaria"'
Autor:
Ketul B. Sutaria, Minki Cho, Anisur Rahman, Jihan Standfest, Rahul Sharma, Swaroop Namalapuri, Shiv Gupta, Bahar Ajdari, Ricardo Ascazubi, Balkaran Gill
Publikováno v:
2022 IEEE International Reliability Physics Symposium (IRPS).
Autor:
Jeffery Hicks, Swaroop Kumar Namalapuri, S. Ramey, Jihan Standfest, A. H. Davoody, Balkaran Gill, P Supriya, T. Mutyala, Ketul B. Sutaria, Inanc Meric
Publikováno v:
IRPS
Circuit reliability is a significant concern in scaled technologies. Physical aging models derived by DC stress on discrete devices are accurate to an extent, but can be further improved by evaluating the behaviour of simple circuits such as ring osc
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 25:2248-2257
Random numbers play a vital role in cryptography, where they are used to generate keys, nonce, one-time pads, and initialization vectors for symmetric encryption. The quality of random number generator (RNG) has significant implications on vulnerabil
Autor:
Lei Jiang, Mark Armstrong, K. W. Park, Inanc Meric, J. Standfest, C. D. Landon, Sell Bernhard, S. Liu, Ketul B. Sutaria, K. Phoa, David Young, C.-Y. Su, J. Wan, L. Paulson, S. A. Kumar, S. Ramey
Publikováno v:
IRPS
This paper describes the transistor reliability of Intel's 22FFL FinFET technology, which includes an extensive variety of device offerings to enable high performance and low power design options. Detailed evaluations of BTI, TDDB, self-heating, and
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 15:384-393
Aging mechanisms such as Bias Temperature Instability (BTI) and Channel Hot Carrier (CHC) are key limiting factors of circuit lifetime in CMOS design. Threshold voltage shift of a device due to degradation is usually a gradual process, only causing m
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 14:607-615
Design for reliability is an increasingly important design step at advanced technology nodes. Aggressive scaling has brought forth reliability issues, such as negative bias temperature instability (NBTI). The aging process due to NBTI exhibits a sign
Autor:
Michael Bajura, Michael Fritze, Jyothi Velamala, Ketul B. Sutaria, Yu Cao, Ivan Sanchez Esqueda, J. R. Ahlbin, Mike Shuo-Wei Chen
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 33:8-23
Integrated circuit design in the late CMOS era is challenged by the ever-increasing variability and reliability issues. The situation is further compounded by real-time uncertainties in workload and ambient conditions, which dynamically influence the
Autor:
Ketul B. Sutaria, Hiromitsu Awano, Hirofumi Shimizu, Gilson Wirth, Yu Cao, Takashi Sato, Jyothi Velamala
Publikováno v:
IEEE Transactions on Electron Devices. 60:3645-3654
The aging process due to negative bias temperature instability (NBTI) is a key limiting factor of circuit lifetimes in CMOS design. Recent NBTI data exhibits an excessive amount of randomness and fast recovery, which are difficult to be handled by co
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 13:340-349
With CMOS technology scaling, design for reliability has become an important step in the design cycle and increased the need for efficient and accurate aging simulation methods during the design stage. NBTI-induced delay shifts in logic paths are asy
Autor:
Ru Huang, Runsheng Wang, Xixiang Feng, Pengpeng Ren, Yu Cao, Abinash Mohanty, Ketul B. Sutaria
Publikováno v:
IRPS
Aging due to bias-temperature-instability (BTI) is the dominant cause of functional failure in large scale logic circuits. Power efficient techniques such as clock gating or dynamic voltage scaling exacerbate the problem of asymmetric aging. Traditio