Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Kesvakumar V. C. Muniandy"'
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The current market trend for chip on chip connection is mainly using copper pillar. The copper pillar technology has been around for many years and advances in the copper pillar technology have grown steadily over the past few years. The main issue w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3afe7bda9553b60541d72c45001b3834
https://doi.org/10.1109/eptc.2015.7412297
https://doi.org/10.1109/eptc.2015.7412297
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Center Gate Molding or also known as Pin Gate Molding is a molding method that is gaining a lot of interest in the market in recent times. This is due to its improvement in wire sweep performance for ultra fine pitch wire bonding and ability to capit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd8d4c1c9c4d2d07e41bff5837f966be
https://doi.org/10.1109/eptc.2012.6507040
https://doi.org/10.1109/eptc.2012.6507040
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Top-gate molding systems have been commercially available for mass production for more than 5 years. Key attractions to this relatively new molding concept are its improvement in wire sweep performance for ultra fine pitch wire bonding and ability to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6593b8994e69036ea7706fc9df955ce7
https://doi.org/10.1109/iemt.2006.4456484
https://doi.org/10.1109/iemt.2006.4456484