Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Kesvakumar"'
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
The numbers of electronic devices are increasing year on year basis in our cars. New additions such as Autonomous Self Driving, ADAS and e-mobility: electrification of cars will include charging and thereby extend further in future our expected requi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc521268aad5fcd20d33eeba39c21e80
https://doi.org/10.1109/eptc.2018.8654301
https://doi.org/10.1109/eptc.2018.8654301
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Bare die flip chip products have a high risk of die cracking as shown in Figure 1, during product electrical test or temperature cycling. The stresses experienced by the die during these events are understood. But the die strength impact after produc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a805af46c30770cb7230f724a236fd8e
https://doi.org/10.1109/eptc.2016.7861540
https://doi.org/10.1109/eptc.2016.7861540
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The current market trend for chip on chip connection is mainly using copper pillar. The copper pillar technology has been around for many years and advances in the copper pillar technology have grown steadily over the past few years. The main issue w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3afe7bda9553b60541d72c45001b3834
https://doi.org/10.1109/eptc.2015.7412297
https://doi.org/10.1109/eptc.2015.7412297
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Center Gate Molding or also known as Pin Gate Molding is a molding method that is gaining a lot of interest in the market in recent times. This is due to its improvement in wire sweep performance for ultra fine pitch wire bonding and ability to capit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd8d4c1c9c4d2d07e41bff5837f966be
https://doi.org/10.1109/eptc.2012.6507040
https://doi.org/10.1109/eptc.2012.6507040
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Package warpage or generally referred to as plastic package deformation has become more challenging with larger and thinner package body sizes. The detrimental effects of the package warpage are more prominent in peripheral packages with leads such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0c2b7327a3b50d01eea9930dde2535d
https://doi.org/10.1109/iemt.2010.5746703
https://doi.org/10.1109/iemt.2010.5746703
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Top-gate molding systems have been commercially available for mass production for more than 5 years. Key attractions to this relatively new molding concept are its improvement in wire sweep performance for ultra fine pitch wire bonding and ability to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6593b8994e69036ea7706fc9df955ce7
https://doi.org/10.1109/iemt.2006.4456484
https://doi.org/10.1109/iemt.2006.4456484
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC); 2012, p4-7, 4p
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2010, p1-6, 6p
Publikováno v:
2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-3, 3p
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