Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Kerry Song"'
Publikováno v:
ECS Transactions. 60:453-457
Cu capping layer deposition plays an important role in BEOL plasma induced damage. In this paper, PID issue by Cu capping layer deposition process studied. The PID performance was studied with Cu capping layer deposition recipe optimization. And, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bcb7ca587758d6ae257d5a1100e783e
https://doi.org/10.1149/06001.0453ecst
https://doi.org/10.1149/06001.0453ecst
Publikováno v:
ECS Transactions. 60:573-579
As the development of technology node, ULK was used as isolation material in Cu damascene integration. ULK is a porous material with low mechanical strength and low adhesion. During CMP process, slurry additive and moisture will enter the hole of ULK
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a78e1ea5ba4dc0b71c6e7aa040c6a2ce
https://doi.org/10.1149/06001.0573ecst
https://doi.org/10.1149/06001.0573ecst
Publikováno v:
ECS Transactions. 60:613-617
As the technology node is advanced to 28nm and below, several new materials are introduced such as ultra low-k dielectric and metal hard mask. This presents critical chalenges to Cu-CMP in terms of k-shift, poor within-die uniformity and deteriorated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96c15866d0cd75b672645bf17bdbd717
https://doi.org/10.1149/06001.0613ecst
https://doi.org/10.1149/06001.0613ecst
Autor:
Kent Liu, Jason Zhang, Hongtao Liu, Feng Zhao, Kerry Song, Wufeng Deng, Junzhu Cao, Sky Zhou, Feng Chen, Ethan Bao, Jun Zhao, Erico Zhou, Tony Hu, Larry Chen
Publikováno v:
ECS Transactions. 44:531-536
Novel CuCMP slurry was evaluated under different polishing conditions and its impact on topography, thickness and in line test performance was investigated. Generally, topography, such as dishing and erosion, results from over-polishing after Cu poli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba10b38d48bfdbaa293fdbaa1d381634
https://doi.org/10.1149/1.3694365
https://doi.org/10.1149/1.3694365