Zobrazeno 1 - 10
of 83
pro vyhledávání: '"Keon‐Soo Jang"'
Publikováno v:
Polymers, Vol 16, Iss 19, p 2737 (2024)
The increasing environmental concerns and stringent regulations targeting emissions and energy efficiency necessitate innovative material solutions that not only comply with these standards but also enhance performance and sustainability. This study
Externí odkaz:
https://doaj.org/article/7d0ee88f0c8342efb83ecc107b61a853
Publikováno v:
ACS Omega, Vol 8, Iss 49, Pp 46955-46966 (2023)
Externí odkaz:
https://doaj.org/article/df9cd3bd9e9c48a99734707dbae6125d
Publikováno v:
ACS Omega, Vol 8, Iss 42, Pp 39135-39142 (2023)
Externí odkaz:
https://doaj.org/article/7a53cb5e59114d2f8a4263e5ae0bfd2a
Publikováno v:
Polymers, Vol 16, Iss 7, p 896 (2024)
The growing demand for lightweight and durable materials in industries, such as the automotive, aerospace, and electronics industries, has spurred the development of heterojunction bilayer composites, combining the structural integrity of metals with
Externí odkaz:
https://doaj.org/article/bcb64ba5b9244fa0aa1104c66d0f7549
Publikováno v:
ACS Omega, Vol 9, Iss 4, Pp 5080-5081 (2024)
Externí odkaz:
https://doaj.org/article/ccc5ec0ca5774012b4745c18fec60c1b
Autor:
Hayun Jeong, Keon-Soo Jang
Publikováno v:
Polymers, Vol 16, Iss 3, p 439 (2024)
Epoxy resins find extensive utility across diverse applications owing to their exceptional adhesion capabilities and robust mechanical and thermal characteristics. However, the demanding reaction conditions, including extended reaction times and elev
Externí odkaz:
https://doaj.org/article/b7061e32b1834963a0cc1ce1e2c3c234
Publikováno v:
Polymers, Vol 16, Iss 3, p 398 (2024)
The investigation of interconnection technologies is crucial for advancing semiconductor packaging technology. This study delved into the various methods of achieving electrical interconnections, focusing on the sintering process and composition of t
Externí odkaz:
https://doaj.org/article/953ecc25483e44da9f44c38eb083efa5
Publikováno v:
ACS Omega, Vol 6, Iss 47, Pp 31876-31890 (2021)
Externí odkaz:
https://doaj.org/article/aba367632a7947649a7a40d03fb8914d
Autor:
Soohyun Kim, Keon-Soo Jang
Publikováno v:
Scientific Reports, Vol 10, Iss 1, Pp 1-8 (2020)
Abstract Tubular architecture has been extensively exploited in diverse applications such as solar cells and sensors. However, the synthesis of microtubes with high aspect ratio using polymer templates has been rarely reported. In this study, we desi
Externí odkaz:
https://doaj.org/article/fe51d65545b04dbbb4187d7a3eaf5898
Publikováno v:
ETRI Journal, Vol 41, Iss 6, Pp 820-828 (2019)
A highly reliable conductive adhesive obtained by transient liquid‐phase sintering (TLPS) technologies is studied for use in high‐power device packaging. TLPS involves the low‐temperature reaction of a low‐melting metal or alloy with a high
Externí odkaz:
https://doaj.org/article/605d4511fb2f46ffba5dc08bbad6bfd5