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pro vyhledávání: '"Kenzou Ohkita"'
Autor:
Kenzou Ohkita, Toyohiro Aoki, Yasuharu Yamada, Yasumitsu Orii, Koichi Hasegawa, Eiji Nakamura, Jun Mukawa, Hiroyuki Mori, Takashi Hisada, Seiichirou Takahashi, Chihiro Kobata
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Fine pitch interconnect is one of key technology elements for 2.5D and 3D IC. Low cost and flexibility in technical aspects are also important, so that the technology can be used for wide range of applications. We have newly developed a non-strip typ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86a1eb5768c58545ccd7d4a4d275aada
https://doi.org/10.1109/ectc.2016.339
https://doi.org/10.1109/ectc.2016.339
