Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Kenzo Hanawa"'
Publikováno v:
Journal of Chemistry, Vol 2021 (2021)
All-vanadium flow batteries (VRFBs) are used in the field of energy storage due to their long service life and high safety. In order to further improve the charge-discharge performance of VRFB, this study mainly used the comparative evaluation of VRF
Externí odkaz:
https://doaj.org/article/e81a2347b1334ff190325a26b15818cf
Publikováno v:
Coatings, Vol 11, Iss 736, p 736 (2021)
Coatings
Volume 11
Issue 6
Coatings
Volume 11
Issue 6
Carbon fiber, as an electrode material, has been widely used in all-vanadium liquid flow batteries. In order to further reduce the size of the all-vanadium storage system, it is imperative to increase the current density of the battery and to achieve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf0d6e7af9549a919a321919b9aafbf6
https://doi.org/10.3390/coatings11060736
https://doi.org/10.3390/coatings11060736
Publikováno v:
Journal of The Electrochemical Society. 146:1251-1255
The electrochemical behavior of chemically prepared α-phase Al-substituted Ni(OH) 2 was investigated in relation to its crystallinity. α-Phase samples with 5-20% Al were prepared by precipitation, and the crystallinity was tailored by changing the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfc955fa661d76ffe11c97f1ccd397b3
https://doi.org/10.1149/1.1391754
https://doi.org/10.1149/1.1391754
Autor:
Sadahiro Kishii, Toshiro Doi, Satoru Watanabe, Syuhei Kurokawa, Yoshihiro Arimoto, Kenzo Hanawa, Ko Nakamura
Publikováno v:
Japanese Journal of Applied Physics. 51:04DB07
Fumed silica is widely used in SiO2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, and used slurry is disposed. Sustainable development demands a reduction in waste. Since reuse of slurry is effective for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14455e810004f6a8a22040b74f8d3524
https://doi.org/10.1143/jjap.51.04db07
https://doi.org/10.1143/jjap.51.04db07
Autor:
Satoru Watanabe, Kenzo Hanawa, Sadahiro Kishii, Toshiro Doi, Yoshihiro Arimoto, Ko Nakamura, Syuhei Kurokawa
Publikováno v:
Japanese Journal of Applied Physics. 51:046506
Fumed silica is widely used for SiO2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, the used slurry being disposed of. We have demonstrated that Mn2O3 abrasive slurry polishes dielectric SiO2 film, giving
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9907106c3a662fc625bab03de38c9541
https://doi.org/10.1143/jjap.51.046506
https://doi.org/10.1143/jjap.51.046506
Autor:
Sadahiro Kishii, Ko Nakamura, Kenzo Hanawa, Satoru Watanabe, Yoshihiro Arimoto, Syuhei Kurokawa, Toshiro K. Doi
Publikováno v:
Japanese Journal of Applied Physics. 51:04DB07
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b7719ca2d629efcb29bbe090d31fca3
https://doi.org/10.7567/jjap.51.04db07
https://doi.org/10.7567/jjap.51.04db07
Autor:
Sadahiro Kishii, Ko Nakamura, Kenzo Hanawa, Satoru Watanabe, Yoshihiro Arimoto, Syuhei Kurokawa, Toshiro K. Doi
Publikováno v:
Japanese Journal of Applied Physics. 51:046506
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26b4018cfdcb23652310b4e42e91decb
https://doi.org/10.7567/jjap.51.046506
https://doi.org/10.7567/jjap.51.046506
Autor:
Syuhei Kurokawa, Sadahiro Kishii, Kenzo Hanawa, Yoshihiro Arimoto, Ko Nakamura, Satoru Watanabe, Toshiro Doi
Publikováno v:
Japanese Journal of Applied Physics. 51:016501
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7dc4f04bcacd750b106fb0d052f87017
https://doi.org/10.7567/jjap.51.016501
https://doi.org/10.7567/jjap.51.016501
Autor:
Sadahiro Kishii, Kenzo Hanawa, Yoshihiro Arimoto, Syuhei Kurokawa, Satoru Watanabe, Ko Nakamura, Toshiro Doi
Publikováno v:
Japanese Journal of Applied Physics. 51:016501
MnO2 slurry can polish SiO2 film faster and planarize wide feature steps (2 ×2 mm2) to a lower height than conventional silica slurry. A comparison of Gibbs free energies indicates that the MnO2 abrasive directly reacts on the SiO2 film. In post-Che
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c38cfb838d96b38941ed17ff56642c5
https://doi.org/10.1143/jjap.51.016501
https://doi.org/10.1143/jjap.51.016501