Zobrazeno 1 - 10 of 51 pro vyhledávání: '"Kentaro Totsu"'
3
Probing Surface Morphology using X-ray Grating Interferometry
Autor: Wataru Yashiro, Kentaro Totsu, Susumu Ikeda, Akihisa Takeuchi, Yasuo Wada, Yoshio Suzuki
Publikováno v: Scientific Reports, Vol 9, Iss 1, Pp 1-8 (2019)
Scientific Reports
X-ray reflectometry (XRR), a surface-sensitive technique widely used for characterizing surfaces, buried interfaces, thin films, and multilayers, enables determination of the electron density distribution perpendicular to a well-defined surface specu
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a509e6dd928388675469ac1f75f7b1ac
http://link.springer.com/article/10.1038/s41598-019-50486-5
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5
MEMS research is better together
Autor: Kentaro Totsu, Masayoshi Esashi, Masaaki Moriyama
Publikováno v: Nature Electronics. 2:134-136
Open collaboration based on shared facilities can accelerate the commercialization of microelectromechanical systems.
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2554130f516d83c91cce21992919af51
https://doi.org/10.1038/s41928-019-0236-z
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6
Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level Packaging
Autor: Mitsutomo Nishizawa, Masayuki Miyairi, Sasaki Yuya, Kentaro Totsu, Toshinori Ogashiwa, Hiroyuki Ishida, Hiroshi Murai, Yukio Kanehira, Masayoshi Esashi, Shuji Tanaka
Publikováno v: International Symposium on Microelectronics. 2015:000073-000078
Au/Au hermetic sealing was successfully done using a rim structure covered with sub-micron-size Au particles by low-temperature thermo-compression bonding. The easy deformability of sintered Au particles is advantageous in terms of the compliance wit
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ab34e76e49751529c1f96466ea0b74b0
https://doi.org/10.4071/isom-2015-tp32
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7
Free-standing subwavelength grid infrared cut filter of 90 mm diameter for LPP EUV light source
Autor: Shuji Tanaka, Yukio Suzuki, Masaaki Moriyama, Masayoshi Esashi, Kentaro Totsu
Publikováno v: Sensors and Actuators A: Physical. 231:59-64
A subwavelength grid infrared (IR) cut filter as large as 90 mm in diameter was fabricated and tested on a 6 inch Si wafer for a laser-produced plasma (LPP) extreme ultraviolet (EUV) light source used in the next generation lithography tools. The IR
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0522aa0ea2c09b74203a07ed6ef9bf94
https://doi.org/10.1016/j.sna.2014.07.006
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