Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Kentaro Tatsukoshi"'
Autor:
Hiroyuki Kato, Tatsuaki Miwa, Janine Quijano, Leonard Medrano, Jose Ortiz, Akiko Desantis, Keiko Omori, Aya Wada, Kentaro Tatsukoshi, Fouad Kandeel, Yoko Mullen, Hsun Teresa Ku, Hirotake Komatsu
Publikováno v:
Frontiers in Endocrinology, Vol 13 (2022)
BackgroundTransplantation of the human pancreatic islets is a promising approach for specific types of diabetes to improve glycemic control. Although effective, there are several issues that limit the clinical expansion of this treatment, including d
Externí odkaz:
https://doaj.org/article/464c9420acd848cba8fbb35c40f514de
Autor:
Kentaro Tatsukoshi, Hiroshi Yukawa, Masaru Hori, Daisuke Onoshima, Kenji Ishikawa, Yoshinobu Baba, Hiroshi Hashizume, Takumi Ito, Hidefumi Odaka, Makoto Sekine, Hiroki Kondo, Hiromasa Tanaka, Naoto Kihara, Keigo Takeda
Publikováno v:
IEEE Transactions on Plasma Science. 44:3060-3065
In the field of microfluidics, it is possible to facilitate liquid transport through microsized holes with large slip lengths by lowering the friction at the interface between the flow and the inner surface of the holes. In this paper, we discuss the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::92a30ceb9a34cc495939bca5c7d2bafb
https://doi.org/10.1109/tps.2016.2571721
https://doi.org/10.1109/tps.2016.2571721
Autor:
Yasuji Fukasawa, Mamoru Mitsuishi, Kentaro Tatsukoshi, Naohiko Sugita, Keisuke Nagato, Yusuke Ito, Toru Kizaki, Rin Shinomoto
Publikováno v:
International Journal of Automation Technology. 10:863-873
Ultrashort pulse laser processing that facilitates high-speed and fine processing of glass materials has received considerable attention in recent years, despite mechanical processing or etching having been the mainstream methods. However, the physic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::649c941e5daef32151dcd86449d60d8a
https://doi.org/10.20965/ijat.2016.p0863
https://doi.org/10.20965/ijat.2016.p0863
Autor:
Rin Shinomoto, Keisuke Nagato, Naohiko Sugita, Yusuke Ito, Yasuji Fukasawa, Toru Kizaki, Kentaro Tatsukoshi, Mamoru Mitsuishi, Akinori Otsu
Publikováno v:
Applied Physics A. 124
The development of femtosecond lasers has renovated micromachining technology, enabling the microdrilling of transparent materials at high speed. Although effective, this technique is still imperfect because irregular microscopic damage occurs during
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f7e1713990a8c597220981619341dedc
https://doi.org/10.1007/s00339-018-1607-4
https://doi.org/10.1007/s00339-018-1607-4
Publikováno v:
International Symposium on Microelectronics. 2013:000631-000634
This study explores Through Glass Via (TGV) formation technology and metallization technology for glass interposer. 3D packaging has presently attracted lots of attention. The interposer is recognized as one of key materials, and its development of n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abfe7c08dab1baed2589fba2f1a2eb8e
https://doi.org/10.4071/isom-2013-wp14
https://doi.org/10.4071/isom-2013-wp14
Autor:
Shoichi Konishi, Svend Hoyer, Kenji Kitaoka, Adrien Chaize, Shintaro Takahashi, Christian Schmidt, Leander Dittmann, Motoshi Ono, Kentaro Tatsukoshi
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000811-000831
Glass is expected to be applied to a core material for panel size interposer for 3D package system nowadays. The most important challenge for glass as an interposer is the development of through hole formation with cost-effective and high-throughput.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::862b5d8f4e21dd8a50bd6752fab13991
https://doi.org/10.4071/2012dpc-tp13
https://doi.org/10.4071/2012dpc-tp13
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 64:837-842
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfef8ce2e4e1a578231b00e00c0bd338
https://doi.org/10.1299/kikaib.64.837
https://doi.org/10.1299/kikaib.64.837
Autor:
Shintaro Takahashi, Nobuhiko Imajo, Kentaro Tatsukoshi, Motoshi Ono, Kohei Horiuchi, Tim Mobely
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This study explored Through Glass Via (TGV) Formation Technology by using Focused Electrical Discharging Method for alkali-fee glass which has well matched CTE with Si. 2.5D/3D Packaging has presently attracted lots of attention, an interposer is rec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73083cd587a616535b9c13df9e7661cb
https://doi.org/10.1109/ectc.2013.6575594
https://doi.org/10.1109/ectc.2013.6575594
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 62:1563-1569
We present an experimental study on the effects of thermal conditions on sink-mark generation of press-formed glass products. In experiments, the depth of sink-marks of glass was investigated with variation of the weight of the glass, the initial tem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::643439b2e07573e9624bdb08cb0dc0e9
https://doi.org/10.1299/kikaib.62.1563
https://doi.org/10.1299/kikaib.62.1563
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
This study explored glass microfabrication technologies for TGV (Through Glass Via) formation can be applied interposer substrate of 3D packaging. Two TGV formation methods were studied and compared such as optical approach using Excimer laser and el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a08eb38bd6bfce25631a2cfc689881e
https://doi.org/10.1109/estc.2012.6542128
https://doi.org/10.1109/estc.2012.6542128