Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Kentaro Takao"'
Autor:
Takeshi Hatsuzawa, Kentaro Takao
Publikováno v:
Journal of the Japan Society for Precision Engineering. 86:558-561
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d10b9de7917ad530beea4a320ad6ee06
https://doi.org/10.2493/jjspe.86.558
https://doi.org/10.2493/jjspe.86.558
Autor:
Kentaro Takao, Eitaro Miyake, Tatsuya Kobayashi, Fumiyoshi Kawashiro, Masaaki Yoshikawa, Hiroshi Nishikawa, Yoshiki Endo, Tatsuo Tonedachi
Publikováno v:
Microelectronics Reliability. 99:168-176
Recently, there have been moves to replace Si power devices with SiC ones, which will require new materials with higher thermal conductivity for power module assemblies owing to their higher operating temperatures. Al wire bond interconnections suffe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::faad013a35f2723a07b26abd91aa6d7b
https://doi.org/10.1016/j.microrel.2019.04.016
https://doi.org/10.1016/j.microrel.2019.04.016
Autor:
Kentaro Takao, Masazumi Amagai
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
An unique adhesion testing was developed, in which a corner edge of a mold compound was adhered to a lead frame on a diagonal line while making 90° rotation, in addition, mechanical loading was applied to the corner of interfacial edge between dissi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16f3d4a4b35767bc6a676297fec68189
https://doi.org/10.1109/ectc.2013.6575572
https://doi.org/10.1109/ectc.2013.6575572